Datasheet LT3055 (Analog Devices) - 5

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ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 2) PARAMETER CONDITIONS MIN TYP MAX UNITS
FAULT, PWRGD Pins Logic Low Voltage Pull-Up Current = 50μA l 0.14 0.25 V FAULT, PWRGD Pins Leakage Current VFAULT1, VFAULT2, VPWRGD = 5V 0.01 1 μA IMIN Threshold Accuracy (Notes 6, 9) 5.6V < VIN < 15V, VOUT = 5V, RIMIN = 1.2M l 0.9 1 1.1 mA 5.6V < VIN < 15V, VOUT = 5V, RIMIN = 120K l 9 10 11 mA PWRGD Trip Point % of Nominal Output Voltage, Output Rising l 86 90 94 % PWRGD Trip Point Hysteresis % of Nominal Output Voltage 1 % Current Monitor Ratio (Notes 6,10), Ratio = IOUT/IMON ILOAD = 10mA, 250mA, 500mA l 450 500 550 mA/mA TEMP Voltage (Note 16) TJ = 25°C 0.25 V TJ = 125°C 1.25 V TEMP Error (Note 16) l –0.08 0.08 V
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 8:
Current limit varies inversely with the external resistor value tied may cause permanent damage to the device. Exposure to any Absolute from the IMAX pin to GND. For detailed information on how to set the IMAX Maximum Rating condition for extended periods may affect device pin resistor value, please see the Operation section. If a programmed reliability and lifetime. Absolute maximum input-to-output differential current limit is not needed, tie the IMAX pin to GND and internal protection voltage is not achievable with all combinations of rated IN pin and OUT pin circuitry implements short-circuit protection as specified. voltages. With the IN pin at 50V, the OUT pin may not be pulled below 0V.
Note 9:
The I The total differential voltage from IN to OUT must not exceed +50V, –40V. MIN fault condition asserts if the output current falls below the I If OUT is pulled above GND and IN, the total differential voltage from OUT MIN threshold defined by an external resistor from the IMIN pin to GND. For detailed information on how to set the I to IN must not exceed 40V. MIN pin resistor value, please see the Operation section. If the IMIN fault condition is not needed, the IMIN
Note 2:
The LT3055 is tested and specified under pulse load conditions pin must be left floating (unconnected). such that TJ ~ TA. The LT3055E is 100% production tested at TA = 25°C
Note 10:
Current monitor ratio is tested with the I and performance is guaranteed from 0°C to 125°C. Performance at –40°C MON pin fixed at V and 125°C is assured by design, characterization and correlation with OUT – 0.5V and with the input range limited to VOUT + 0.6V < VIN < VOUT + 10V for I statistical process controls. The LT3055I is guaranteed over the full –40°C OUT = 10mA; VOUT + 0.6V < VIN < VOUT + 4V for IOUT = 250mA, and V to 125°C operating junction temperature range. The LT3055MP is 100% OUT + 0.6V < VIN < VOUT + 2V for IOUT = 500mA. Input voltage range conditions are set to limit power dissipation in the IC to 1W maximum for tested over the –55°C to 150°C operating junction temperature range. The test purposes. The current monitor ratio varies slightly when in current LT3055H is 100% tested at 150°C operating junction temperature. limit or when the IMON voltage exceeds VOUT – 0.5V. Please see the
Note 3:
The LT3055 adjustable version is tested and specified for these Operation section for more information. If the current monitor function is conditions with ADJ pin connected to the OUT pin. not needed, tie the IMON pin to GND.
Note 4:
Maximum junction temperature limits operating conditions.
Note 11:
To satisfy requirements for minimum input voltage, current limit Regulated output voltage specifications do not apply for all possible is tested at VIN = VOUT(NOMINAL) + 1V or VIN = 2.2V, whichever is greater. combinations of input voltage and output current. If operating at the
Note 12:
ADJ pin bias current flows out of the ADJ pin. maximum input voltage, limit the output current range. If operating at the maximum output current, limit the input voltage range. Current limit
Note 13:
SHDN pin current flows into the SHDN pin. foldback limits the maximum output current as a function of input-to-
Note 14:
Reverse output current is tested with the IN pin grounded and the output voltage. See Current Limit vs VIN-VOUT in the Typical Performance OUT pin forced to the specified voltage. This current flows into the OUT Characteristics section. pin and out of the GND pin.
Note 5:
Dropout voltage is the minimum differential IN-to-OUT voltage
Note 15:
500mA of output current does not apply to the full range of input needed to maintain regulation at a specified output current. In dropout, voltage due to the internal current limit foldback. the output voltage equals (VIN – VDROPOUT). For some output voltages,
Note 16:
The TEMP output voltage represents the average temperature of minimum input voltage requirements limit dropout voltage. the die while dissipating quiescent power. Due to the pass device power
Note 6:
To satisfy minimum input voltage requirements, the LT3055 dissipation and temperature gradients across the die, the TEMP output adjustable version is tested and specified for these conditions with an voltage measurement does not guarantee that absolute maximum junction external resistor divider (60k bottom, 440k top) which sets VOUT to 5V. The temperature is not exceeded. external resistor divider adds 10μA of DC load on the output. This external
Note 17:
Minimum Input Voltage is the input voltage at which the output current is not factored into GND pin current. voltage is decreased 1% from nominal. At elevated temperatures, an input
Note 7:
GND pin current is tested with VIN = VOUT(NOMINAL) + 0.6V and a voltage greater than this is necessary for correct operation of the TEMP current source load. GND pin current increases in dropout. For the fixed pin. See Temp Pin Minimum Input Voltage in the Typical Performance output voltage versions, an internal resistor divider adds about 10µA to Characteristics section. GND pin current. See GND pin current curves in the Typical Performance Characteristics section. Rev. B For more information www.analog.com 5 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Revision History Typical Application Related Parts