Datasheet ADP151 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | Ultralow Noise, 200 mA, CMOS Linear Regulator |
| 页数 / 页 | 23 / 6 — ADP151. Data Sheet. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. VIN. … |
| 修订版 | H |
| 文件格式/大小 | PDF / 600 Kb |
| 文件语言 | 英语 |
ADP151. Data Sheet. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. VIN. VOUT 1. 6 VIN. VOUT. GND. NC 2. 5 NC. TOP VIEW. (Not to Scale). 4 EN
该数据表的模型线
- ADP151ACBZ-1.1-R7 ADP151ACBZ-1.2-R7 ADP151ACBZ-1.5-R7 ADP151ACBZ-1.8-R7 ADP151ACBZ-2.1-R7 ADP151ACBZ-2.5-R7 ADP151ACBZ-2.6-R7 ADP151ACBZ-2.75-R7 ADP151ACBZ-2.8-R7 ADP151ACBZ-2.85-R7 ADP151ACBZ-3.0-R7 ADP151ACBZ-3.3-R7 ADP151ACPZ-1.2-R7 ADP151ACPZ-1.5-R7 ADP151ACPZ-1.8-R7 ADP151ACPZ-2.5-R7 ADP151ACPZ-2.7-R7 ADP151ACPZ-2.8-R7 ADP151ACPZ-3.0-R7 ADP151ACPZ-3.3-R7 ADP151AUJZ-1.2-R7 ADP151AUJZ-1.5-R7 ADP151AUJZ-1.8-R7 ADP151AUJZ-2.5-R7 ADP151AUJZ-2.8-R7 ADP151AUJZ-2.9-R7 ADP151AUJZ-3.0-R7 ADP151AUJZ-3.3-R7 ADP151TUJZ3.3-EPR2 ADP151WACBZ-1.1-R7 ADP151WACBZ-1.2-R7 ADP151WACBZ-1.5-R7 ADP151WACBZ-1.8-R7 ADP151WACBZ-2.1-R7 ADP151WACBZ-2.5-R7 ADP151WACBZ-2.6-R7 ADP151WACBZ-2.75-R7 ADP151WACBZ-2.8-R7 ADP151WACBZ-2.85-R7 ADP151WACBZ-3.0-R7 ADP151WACBZ-3.3-R7
文件文字版本
ADP151 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS VIN VOUT 1 6 VIN 1 5 VOUT ADP151 ADP151 GND NC 2 5 NC 2 TOP VIEW TOP VIEW (Not to Scale) (Not to Scale)
048
4 EN EN GND 3 3 4 NC
08627- 003
NC = NO CONNECT NOTES
08627-
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED PAD MUST BE CONNECTED TO GROUND.
Figure 4. 5-Lead TSOT Pin Configuration Figure 6. 6-Lead LFCSP Pin Configuration
1 2 A VIN VOUT TOP VIEW (Not to Scale) B EN GND
004 08627- Figure 5. 4-Ball WLCSP Ball Configuration
Table 5. Pin Function Descriptions Pin No. TSOT WLCSP LFCSP Mnemonic Description
1 A1 6 VIN Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor. 2 B2 3 GND Ground. 3 B1 4 EN Enable Input. Drive EN high to turn on the regulator and drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 4 Not applicable 2 NC No Connect. Not connected internal y. 5 A2 1 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor. Not applicable Not applicable 5 NC No Connect. Not connected internal y. Not applicable Not applicable EPAD Exposed Pad. The exposed pad must be connected to ground. The exposed pad enhances the thermal performance of the package. Rev. H | Page 6 of 23 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL DATA THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties ENABLE FEATURE ADJUSTABLE OUTPUT VOLTAGE OPERATION CURRENT-LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
048
4 EN EN GND 3 3 4 NC
08627- 003
NC = NO CONNECT NOTES
08627-
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED PAD MUST BE CONNECTED TO GROUND.
Figure 4. 5-Lead TSOT Pin Configuration Figure 6. 6-Lead LFCSP Pin Configuration
1 2 A VIN VOUT TOP VIEW (Not to Scale) B EN GND
004 08627- Figure 5. 4-Ball WLCSP Ball Configuration
Table 5. Pin Function Descriptions Pin No. TSOT WLCSP LFCSP Mnemonic Description
1 A1 6 VIN Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor. 2 B2 3 GND Ground. 3 B1 4 EN Enable Input. Drive EN high to turn on the regulator and drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 4 Not applicable 2 NC No Connect. Not connected internal y. 5 A2 1 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor. Not applicable Not applicable 5 NC No Connect. Not connected internal y. Not applicable Not applicable EPAD Exposed Pad. The exposed pad must be connected to ground. The exposed pad enhances the thermal performance of the package. Rev. H | Page 6 of 23 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL DATA THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties ENABLE FEATURE ADJUSTABLE OUTPUT VOLTAGE OPERATION CURRENT-LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS