Datasheet ADP151-EP (Analog Devices) - 5

Enhanced Product ADP151-EP ABSOLUTE MAXIMUM RATINGS
board design is required. The value of θ
Table 3.
JA may vary, depending on PCB material, layout, and environmental conditions. The
Parameter Rating
specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit VIN to GND −0.3 V to +6.5 V board. See JESD51-7 for detailed information on the board VOUT to GND −0.3 V to VIN construction. EN to GND −0.3 V to +6.5 V Ψ Storage Temperature Range −65°C to +150°C JB is the junction-to-board thermal characterization parameter with units of °C/W. Ψ Operating Junction Temperature Range −55°C to +125°C JB of the package is based on modeling and calculation using a 4-layer board. The JESD51-12, Guidelines for Operating Ambient Temperature Range −55°C to +125°C Reporting and Using Electronic Package Thermal Information, states Soldering Conditions JEDEC J-STD-020 that thermal characterization parameters are not the same as Stresses above those listed under absolute maximum ratings thermal resistances. ΨJB measures the component power flowing may cause permanent damage to the device. This is a stress through multiple thermal paths rather than a single path as in rating only and functional operation of the device at these or thermal resistance, θJB. Therefore, ΨJB thermal paths include any other conditions above those indicated in the operational convection from the top of the package as wel as radiation from section of this specification is not implied. Exposure to absolute the package, factors that make ΨJB more useful in real-world maximum rating conditions for extended periods may affect applications. Maximum junction temperature (TJ) is calculated device reliability. from the board temperature (TB) and power dissipation (PD)
THERMAL DATA
using the formula Absolute maximum ratings apply individually only, not in TJ = TB + (PD × ΨJB) combination. The ADP151-EP can be damaged when the See JESD51-8 and JESD51-12 for more detailed information junction temperature limits are exceeded. Monitoring ambient about ΨJB. temperature does not guarantee that TJ is within the specified
THERMAL RESISTANCE
temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient θJA and ΨJB are specified for the worst-case conditions, that is, a temperature may have to be derated. device soldered in a circuit board for surface-mount packages. In applications with moderate power dissipation and low PCB
Table 4. Thermal Resistance
thermal resistance, the maximum ambient temperature can
Package Type θ Ψ Unit JA JB
exceed the maximum limit as long as the junction temperature 5-Lead TSOT 174 43 °C/W is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the
ESD CAUTION
power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (θJA). The maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula T J = TA + (PD × θJA) The junction-to-ambient thermal resistance (θ JA) of the package is based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal Rev. 0 | Page 5 of 16 Document Outline Features Applications Typical Application Circuit General Description Revision History Specifications Input and Output Capacitor, Recommended Specifications Absolute Maximum Ratings Thermal Data Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Applications Information Thermal Considerations Printed Circuit Board Layout Considerations Outline Dimensions Ordering Guide