Datasheet ADP1712, ADP1713, ADP1714 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | 300 mA, Low Dropout CMOS Linear Regulator |
| 页数 / 页 | 16 / 5 — ADP1712/ADP1713/ADP1714. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. … |
| 修订版 | A |
| 文件格式/大小 | PDF / 496 Kb |
| 文件语言 | 英语 |
ADP1712/ADP1713/ADP1714. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter Rating. Table 3. Thermal Resistance
该数据表的模型线
- ADP1712AUJZ-1.0-R7 ADP1712AUJZ-1.2-R7 ADP1712AUJZ-1.5-R7 ADP1712AUJZ-1.8-R7 ADP1712AUJZ-2.5-R7 ADP1712AUJZ-3.0-R7 ADP1712AUJZ-3.3-R7 ADP1712AUJZ-R7
文件文字版本
ADP1712/ADP1713/ADP1714 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN
Table 3. Thermal Resistance
EN to GND –0.3 V to +6 V
Package Type θJA Unit
SS/ADJ/BYP/TRK to GND –0.3 V to +6 V 5-Lead TSOT 170 °C/W Storage Temperature Range –65°C to +150°C Operating Junction Temperature Range –40°C to +125°C Lead Temperature, Soldering (10 sec) 300°C
ESD CAUTION
Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT-START FUNCTION (ADP1712) ADJUSTABLE OUTPUT VOLTAGE(ADP1712 ADJUSTABLE) BYPASS CAPACITOR (ADP1713) TRACK MODE (ADP1714) ENABLE FEATURE UNDERVOLTAGE LOCKOUT (UVLO) APPLICATION INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN
Table 3. Thermal Resistance
EN to GND –0.3 V to +6 V
Package Type θJA Unit
SS/ADJ/BYP/TRK to GND –0.3 V to +6 V 5-Lead TSOT 170 °C/W Storage Temperature Range –65°C to +150°C Operating Junction Temperature Range –40°C to +125°C Lead Temperature, Soldering (10 sec) 300°C
ESD CAUTION
Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT-START FUNCTION (ADP1712) ADJUSTABLE OUTPUT VOLTAGE(ADP1712 ADJUSTABLE) BYPASS CAPACITOR (ADP1713) TRACK MODE (ADP1714) ENABLE FEATURE UNDERVOLTAGE LOCKOUT (UVLO) APPLICATION INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE