Datasheet AD633-EP (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | Low Cost Analog Multiplier |
| 页数 / 页 | 7 / 4 — AD633-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| 修订版 | B |
| 文件格式/大小 | PDF / 182 Kb |
| 文件语言 | 英语 |
AD633-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Package Type. θ 1. θJC. Unit
该数据表的模型线
文件文字版本
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AD633-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage ±18 V (PCB) design and operating environment. Careful attention to Internal Power Dissipation See Figure 2 PCB thermal design is required. Input Voltages1 ±18 V Output Short-Circuit Duration Indefinite
Table 3.
Storage Temperature Range −65°C to +150°C
Package Type θ 1 2 JA θJC Unit
Operating Temperature Range −55°C to +125°C R-8 123.9 42.8 °C/W Junction Temperature 150°C 1 Test Condition 1: Thermal impedance simulated values are based on JEDEC Lead Temperature (Soldering, 60 sec) 260°C 2S2P thermal test board. See JEDEC JESD51. ESD Rating 1000 V 2 Test Condition 2: Thermal impedance simulate values are based on JEDEC 1S0P thermal test board. See JEDEC JESD51. 1 For supply voltages less than ±18 V, the absolute maximum input voltage is
POWER DERATING CURVE
equal to the supply voltage. Stresses at or above those listed under Absolute Maximum Figure 2 shows the maximum power dissipation vs. the ambient Ratings may cause permanent damage to the product. This is a temperature. stress rating only; functional operation of the product at these
0.7
or any other conditions above those indicated in the operational
) 0.6
section of this specification is not implied. Operation beyond
(W N
the maximum operating conditions for extended periods may
IO 0.5 T
affect product reliability.
PA ISSI 0.4 D ER W 0.3 M PO 0.2 MU XI MA 0.1 0 0 10 20 30 40 50 60 70 80 90 –60 –50 –40 –30 –20 –10 100 110 120 130
102
AMBIENT TEMPERATURE (°C)
16494- Figure 2. Maximum Power Dissipation vs. Ambient Temperature (TA)
ESD CAUTION
Rev. B | Page 4 of 7 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Product Highlights Revision History Specifications Absolute Maximum Ratings Thermal Resistance Power Derating Curve ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide
AD633-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage ±18 V (PCB) design and operating environment. Careful attention to Internal Power Dissipation See Figure 2 PCB thermal design is required. Input Voltages1 ±18 V Output Short-Circuit Duration Indefinite
Table 3.
Storage Temperature Range −65°C to +150°C
Package Type θ 1 2 JA θJC Unit
Operating Temperature Range −55°C to +125°C R-8 123.9 42.8 °C/W Junction Temperature 150°C 1 Test Condition 1: Thermal impedance simulated values are based on JEDEC Lead Temperature (Soldering, 60 sec) 260°C 2S2P thermal test board. See JEDEC JESD51. ESD Rating 1000 V 2 Test Condition 2: Thermal impedance simulate values are based on JEDEC 1S0P thermal test board. See JEDEC JESD51. 1 For supply voltages less than ±18 V, the absolute maximum input voltage is
POWER DERATING CURVE
equal to the supply voltage. Stresses at or above those listed under Absolute Maximum Figure 2 shows the maximum power dissipation vs. the ambient Ratings may cause permanent damage to the product. This is a temperature. stress rating only; functional operation of the product at these
0.7
or any other conditions above those indicated in the operational
) 0.6
section of this specification is not implied. Operation beyond
(W N
the maximum operating conditions for extended periods may
IO 0.5 T
affect product reliability.
PA ISSI 0.4 D ER W 0.3 M PO 0.2 MU XI MA 0.1 0 0 10 20 30 40 50 60 70 80 90 –60 –50 –40 –30 –20 –10 100 110 120 130
102
AMBIENT TEMPERATURE (°C)
16494- Figure 2. Maximum Power Dissipation vs. Ambient Temperature (TA)
ESD CAUTION
Rev. B | Page 4 of 7 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Product Highlights Revision History Specifications Absolute Maximum Ratings Thermal Resistance Power Derating Curve ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide