Datasheet DA9130 (Dialog Semiconductor) - 17

制造商Dialog Semiconductor
描述High-Performance, 10 A, Dual-Phase DC-DC Converter
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DA9130. High-Performance, 10 A, Dual-Phase DC-DC. Converter. Functional Description. 4.1. DC-DC Buck Converter. 4.1.1

DA9130 High-Performance, 10 A, Dual-Phase DC-DC Converter Functional Description 4.1 DC-DC Buck Converter 4.1.1

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DA9130 High-Performance, 10 A, Dual-Phase DC-DC Converter 4 Functional Description 4.1 DC-DC Buck Converter
DA9130 operates as a single-channel dual-phase buck converter capable of delivering up to 10 A output current at a 0.3 V to 1.9 V output voltage range. The buck converter has two voltage registers. One defines the normal output voltage, while the other offers an alternative retention voltage. In this way, different application power modes can easily be supported. The voltage selection can be operated either via GPI or via control interface to guarantee the maximum flexibility according to the specific host processor status in the application. When a buck is enabled, its output voltage is monitored and a power good signal indicates that the buck output voltage has reached a level higher than the VTHR_PG_RISE threshold. The power good status is lost when the voltage drops below VTHR_PG_DWN or increases above VTHR_HV. The status of the power good indicator can be read back via I2C from the PG1 status bit. It can be also individually assigned to any of the GPIOs by setting the GPIO mode registers to PG1 output. The buck converter is capable of supporting DVC transitions that occur when: ● the active and selected A- or B-voltage is updated to a new target value ● the voltage selection is changed from the A- to B-voltage (or B- to A-voltage) using CH1_VSEL The DVC controller operates in pulse width modulation (PWM) mode with synchronous rectification. The slew rate of the DVC transition is programmed at 10 mV per 8 µs, 4 µs, 2 µs, 1 µs, or 0.5 µs in register bits CH1_SR_DVC. A pull-down resistor (typically 150 Ω) for each phase is always activated unless it is disabled by setting register bits CH1_PD_DIS to 1.
4.1.1 Switching Frequency
The buck switching frequency can be tuned using register bit OSC_TUNE. The internal 8 MHz oscillator frequency is tuned in ±160 kHz steps. This impacts the buck converter frequency in steps of 80 kHz and helps to mitigate possible disturbances to other high frequency systems in the application.
4.1.2 Operation Modes and Phase Selection
The buck converters can operate in PWM and PFM modes. The operating mode is selected using register bits CH1_<A or B>_MODE. Phase shedding automatically changes between 1- and 2-phase operation at a typical current of 2.0 A. If the automatic operation mode is selected on CH1_<A or B>_MODE, the buck converter automatically changes between synchronous PWM mode and PFM depending on the load current. This improves the efficiency across the whole range of output load currents.
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 17 of 44 © 2020 Dialog Semiconductor Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection