Datasheet DA9132 (Dialog Semiconductor) - 7
| 制造商 | Dialog Semiconductor |
| 描述 | High-Performance, Dual-Channel DC-DC Converter |
| 页数 / 页 | 53 / 7 — DA9132-A. High-Performance, Dual-Channel DC-DC Converter. Terms and … |
| 文件格式/大小 | PDF / 1.2 Mb |
| 文件语言 | 英语 |
DA9132-A. High-Performance, Dual-Channel DC-DC Converter. Terms and Definitions. Datasheet. Revision 1.0. 31-Aug-2020
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DA9132-A High-Performance, Dual-Channel DC-DC Converter 1 Terms and Definitions
ATE Automated test equipment CPU Central processing unit DDR Dual data rate DVC Dynamic voltage control FET Field effect transistor FM+ Fast mode plus GBD Guaranteed by design GBQ Guaranteed by qualification GBSPC Guaranteed by statistical process characterization GPI General purpose input GPIO General purpose input/output GPU Graphics processing unit IC Integrated circuit HW Hardware OTP One time programmable PCB Printed circuit board PRS Product requirements specification SCL Serial clock SDA Serial data SIPP Single in-line pin package SW Software
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 7 of 53 © 2020 Dialog Semiconductor Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital I/O Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Buck2 5.1.4 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection
ATE Automated test equipment CPU Central processing unit DDR Dual data rate DVC Dynamic voltage control FET Field effect transistor FM+ Fast mode plus GBD Guaranteed by design GBQ Guaranteed by qualification GBSPC Guaranteed by statistical process characterization GPI General purpose input GPIO General purpose input/output GPU Graphics processing unit IC Integrated circuit HW Hardware OTP One time programmable PCB Printed circuit board PRS Product requirements specification SCL Serial clock SDA Serial data SIPP Single in-line pin package SW Software
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 7 of 53 © 2020 Dialog Semiconductor Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital I/O Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Buck2 5.1.4 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection