Datasheet AD8556 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | Digitally Programmable Sensor Signal Amplifier with EMI Filters |
| 页数 / 页 | 27 / 6 — AD8556. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 701 Kb |
| 文件语言 | 英语 |
AD8556. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. THERMAL RESISTANCE. Table 3. Thermal Resistance
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AD8556 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these Supply Voltage 6 V or any other conditions above those indicated in the operational Input Voltage VSS − 0.3 V to VDD + 0.3 V section of this specification is not implied. Operation beyond Differential Input Voltage1 ±5.0 V the maximum operating conditions for extended periods may Output Short-Circuit Duration to Indefinite VSS or VDD affect product reliability. Storage Temperature Range −65°C to +150°C
THERMAL RESISTANCE
Operating Temperature Range −40°C to +150°C θJA is specified for the worst-case conditions, that is, a device Junction Temperature Range −65°C to +150°C soldered in a circuit board for surface-mount packages. Lead Temperature 300°C
Table 3. Thermal Resistance
1 Differential input voltage is limited to ±5.0 V or ± the supply voltage, whichever is less.
Package Type θ 1 JA θJC Unit
8-Lead SOIC_N (R) 158 43 °C/W 16-Lead LFCSP_WQ (CP) 44 31.5 °C/W 1 θJA is specified for the worst-case conditions, that is, θJA is specified for device soldered in circuit board for LFCSP_WQ package.
ESD CAUTION
Rev. B | Page 6 of 27 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY GENERAL DESCRIPTION SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION GAIN VALUES OPEN WIRE FAULT DETECTION SHORTED WIRE FAULT DETECTION FLOATING VPOS, VNEG, OR VCLAMP FAULT DETECTION DEVICE PROGRAMMING Digital Interface Initial State Simulation Mode Programming Mode Parity Error Detection Read Mode Sense Current Programming Procedure Determining Optimal Gain and Offset Codes EMI/RFI PERFORMANCE OUTLINE DIMENSIONS ORDERING GUIDE
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these Supply Voltage 6 V or any other conditions above those indicated in the operational Input Voltage VSS − 0.3 V to VDD + 0.3 V section of this specification is not implied. Operation beyond Differential Input Voltage1 ±5.0 V the maximum operating conditions for extended periods may Output Short-Circuit Duration to Indefinite VSS or VDD affect product reliability. Storage Temperature Range −65°C to +150°C
THERMAL RESISTANCE
Operating Temperature Range −40°C to +150°C θJA is specified for the worst-case conditions, that is, a device Junction Temperature Range −65°C to +150°C soldered in a circuit board for surface-mount packages. Lead Temperature 300°C
Table 3. Thermal Resistance
1 Differential input voltage is limited to ±5.0 V or ± the supply voltage, whichever is less.
Package Type θ 1 JA θJC Unit
8-Lead SOIC_N (R) 158 43 °C/W 16-Lead LFCSP_WQ (CP) 44 31.5 °C/W 1 θJA is specified for the worst-case conditions, that is, θJA is specified for device soldered in circuit board for LFCSP_WQ package.
ESD CAUTION
Rev. B | Page 6 of 27 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY GENERAL DESCRIPTION SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION GAIN VALUES OPEN WIRE FAULT DETECTION SHORTED WIRE FAULT DETECTION FLOATING VPOS, VNEG, OR VCLAMP FAULT DETECTION DEVICE PROGRAMMING Digital Interface Initial State Simulation Mode Programming Mode Parity Error Detection Read Mode Sense Current Programming Procedure Determining Optimal Gain and Offset Codes EMI/RFI PERFORMANCE OUTLINE DIMENSIONS ORDERING GUIDE