Datasheet AMP02 (Analog Devices) - 3
| 制造商 | Analog Devices |
| 描述 | High Accuracy Instrumentation Amplifier |
| 页数 / 页 | 12 / 3 — AMP02. AMP02E. AMP02F. Parameter. Symbol. Conditions. Min. Typ. Max. … |
| 修订版 | E |
| 文件格式/大小 | PDF / 225 Kb |
| 文件语言 | 英语 |
AMP02. AMP02E. AMP02F. Parameter. Symbol. Conditions. Min. Typ. Max. Unit. ABSOLUTE MAXIMUM RATINGS1, 2. Package Type. ORDERING GUIDE
该数据表的模型线
文件文字版本
AMP02 AMP02E AMP02F Parameter Symbol Conditions Min Typ Max Min Typ Max Unit
POWER SUPPLY Supply Voltage Range V ± S 4.5 ±18 ±4.5 ±18 V Supply Current ISY TA = 25°C 5 6 5 6 mA –40°C ≤ TA ≤ +85°C 5 6 5 6 mA NOTES 1Input voltage range guaranteed by common-mode rejection test. 2Guaranteed by design. 3Gain tempco does not include the effects of external component drift. Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1, 2
NOTES 1 Supply Voltage ±18 V Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the Common-Mode Input Voltage [(V–) – 60 V] to [(V+) + 60 V] device at these or any other conditions above those listed in the operational sections Differential Input Voltage [(V–) – 60 V] to [(V+) + 60 V] of this specifications is not implied. Exposure to absolute maximum rating Output Short-Circuit Duration Continuous conditions for extended periods may affect device reliability. 2 Operating Temperature Range –40°C to +85°C Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. Storage Temperature Range –65°C to +150°C 3θJA is specified for worst case mounting conditions, i.e., θJA is specified for Function Temperature Range –65°C to +150°C device in socket for P-DIP package; θJA is specified for device soldered to Lead Temperature (Soldering, 10 sec) 300°C printed circuit board for SOIC package.
Package Type
3
JA JC Unit
8-Lead Plastic DIP (P) 96 37 °C/W 16-Lead SOIC (S) 92 27 °C/W
ORDERING GUIDE VIOS max @ VOOS max @ Temperature Package Model TA = 25
ⴗ
C TA = 25
ⴗ
C Range Description
AMP02EP 100 µV 4 mV –40°C to +85°C 8-Lead Plastic DIP AMP02FP 200 µV 8 mV –40°C to +85°C 8-Lead Plastic DIP AMP02AZ/883C 200 µV 10 mV –55°C to +125°C 8-Lead CERDIP AMP02FS 200 µV 8 mV –40°C to +85°C 16-Lead SOIC AMP02GBC Die AMP02FS-REEL 200 µV 8 mV –40°C to +85°C 16-Lead SOIC
V+ 25k
⍀
SENSE 25k
⍀
25k
⍀
OUT 25k
⍀
REFERENCE –IN +IN RG1 RG2 V–
Figure 2. Simplified Schematic REV. E –3– Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE WAFER TEST LIMITS Typical Performance Characteristics APPLICATIONS INFORMATION Input and Output Offset Voltages Input Bias and Offset Currents Gain Common-Mode Rejection Grounding Sense and Reference Terminals Overvoltage Protection Power Supply Considerations OUTLINE DIMENSIONS Revision History
POWER SUPPLY Supply Voltage Range V ± S 4.5 ±18 ±4.5 ±18 V Supply Current ISY TA = 25°C 5 6 5 6 mA –40°C ≤ TA ≤ +85°C 5 6 5 6 mA NOTES 1Input voltage range guaranteed by common-mode rejection test. 2Guaranteed by design. 3Gain tempco does not include the effects of external component drift. Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1, 2
NOTES 1 Supply Voltage ±18 V Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the Common-Mode Input Voltage [(V–) – 60 V] to [(V+) + 60 V] device at these or any other conditions above those listed in the operational sections Differential Input Voltage [(V–) – 60 V] to [(V+) + 60 V] of this specifications is not implied. Exposure to absolute maximum rating Output Short-Circuit Duration Continuous conditions for extended periods may affect device reliability. 2 Operating Temperature Range –40°C to +85°C Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. Storage Temperature Range –65°C to +150°C 3θJA is specified for worst case mounting conditions, i.e., θJA is specified for Function Temperature Range –65°C to +150°C device in socket for P-DIP package; θJA is specified for device soldered to Lead Temperature (Soldering, 10 sec) 300°C printed circuit board for SOIC package.
Package Type
3
JA JC Unit
8-Lead Plastic DIP (P) 96 37 °C/W 16-Lead SOIC (S) 92 27 °C/W
ORDERING GUIDE VIOS max @ VOOS max @ Temperature Package Model TA = 25
ⴗ
C TA = 25
ⴗ
C Range Description
AMP02EP 100 µV 4 mV –40°C to +85°C 8-Lead Plastic DIP AMP02FP 200 µV 8 mV –40°C to +85°C 8-Lead Plastic DIP AMP02AZ/883C 200 µV 10 mV –55°C to +125°C 8-Lead CERDIP AMP02FS 200 µV 8 mV –40°C to +85°C 16-Lead SOIC AMP02GBC Die AMP02FS-REEL 200 µV 8 mV –40°C to +85°C 16-Lead SOIC
V+ 25k
⍀
SENSE 25k
⍀
25k
⍀
OUT 25k
⍀
REFERENCE –IN +IN RG1 RG2 V–
Figure 2. Simplified Schematic REV. E –3– Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE WAFER TEST LIMITS Typical Performance Characteristics APPLICATIONS INFORMATION Input and Output Offset Voltages Input Bias and Offset Currents Gain Common-Mode Rejection Grounding Sense and Reference Terminals Overvoltage Protection Power Supply Considerations OUTLINE DIMENSIONS Revision History