Datasheet EPC2207 (Efficient Power Conversion) - 6

eGaN® FET DATASHEET
EPC2207
RECOMMENDED
Land pattern is solder mask defined
LAND PATTERN
Solder mask opening is 180 µm (units in µm) It is recommended to have on-Cu trace PCB vias A Pad 1 is Gate;
DIM Nominal
Pads 2 ,4, 6
A
2800
1
g are Source;
B
925 Pads 3, 5 are Drain
c
535 d j
3 4 5
c
6
B
d
775
e
600
2
h
f
250
g
250 f e
h
300
j
500
RECOMMENDED STENCIL DRAWING
(units in µm) A
DIM Nominal A
2800
B
925
c
535 g
d
775
e
600 d j c B
f
250
g
250 h
h
300 R60
j
500 f e Recommended stencil should be 4 mil (100 µm) thick, must be laser cut, openings per drawing. Intended for use with SAC305 Type 3 solder, reference 88.5% metals content. Additional assembly resources available at https://epc-co.com/epc/DesignSupport/AssemblyBasics.aspx Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Information subject to eGaN® is a registered trademark of Efficient Power Conversion Corporation. change without notice. EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx Revised August, 2020 EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2020 | | 6