Datasheet VEMD4010X01 (Vishay) - 4
| 制造商 | Vishay |
| 描述 | Silicon PIN Photodiode |
| 页数 / 页 | 7 / 4 — VEMD4010X01. REFLOW SOLDER PROFILE. DRYPACK. FLOOR LIFE. DRYING. PACKAGE … |
| 文件格式/大小 | PDF / 147 Kb |
| 文件语言 | 英语 |
VEMD4010X01. REFLOW SOLDER PROFILE. DRYPACK. FLOOR LIFE. DRYING. PACKAGE DIMENSIONS
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VEMD4010X01
www.vishay.com Vishay Semiconductors
REFLOW SOLDER PROFILE DRYPACK
Axis Title Devices are packed in moisture barrier bags (MBB) to 300 10000 prevent the products from moisture absorption during Max. 260 °C transportation and storage. Each bag contains a desiccant. 255 °C 250 245 °C 240 °C 217 °C
FLOOR LIFE
200 1000 Floor life (time between soldering and removing from MBB) Max. 30 s ine ne ne must not exceed the time indicated on MBB label: 150 1st li Floor life: 168 h 2nd l 2nd li Max. 120 s Max. 100 s 100 100 Conditions: Tamb < 30 °C, RH < 60 % Temperature (°C) Max. ramp down 6 °C/s Moisture sensitivity level 3, according to J-STD-020. 50 Max. ramp up 3 °C/s
DRYING
0 10 In case of moisture absorption devices should be baked 0 50 100 150 200 250 300 before soldering. Conditions see J-STD-033D or label. 19841 Time (s) Devices taped on reel dry using recommended conditions Fig. 7 - Lead (Pb)-free Reflow Solder Profile 192 h at 40 °C (+ 5 °C), RH < 5 %. According to J-STD-020
PACKAGE DIMENSIONS
in millimeters R0.26 Optical axis 2 1.12 0.15 0.7 0.95 1.25 Technical drawings 0.225 according to DIN specification 0.2 0.1 0.7 Not indicated tolerances ± 0.1 0.8 0.6 Cathode (VEMD4xxx) Collector (VEMT4xxx) Recommended footprint 0.2 1.3 1.225 0.3 0.475 0.6 Anode (VEMD4xxx) 0.9 Emitter (VEMT4xxx) Drawing-No.: 6.550-5363.01-4 Issue: 2; 01.07.2020 Rev. 1.1, 15-Jul-2020
4
Document Number: 80134 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Semiconductors
REFLOW SOLDER PROFILE DRYPACK
Axis Title Devices are packed in moisture barrier bags (MBB) to 300 10000 prevent the products from moisture absorption during Max. 260 °C transportation and storage. Each bag contains a desiccant. 255 °C 250 245 °C 240 °C 217 °C
FLOOR LIFE
200 1000 Floor life (time between soldering and removing from MBB) Max. 30 s ine ne ne must not exceed the time indicated on MBB label: 150 1st li Floor life: 168 h 2nd l 2nd li Max. 120 s Max. 100 s 100 100 Conditions: Tamb < 30 °C, RH < 60 % Temperature (°C) Max. ramp down 6 °C/s Moisture sensitivity level 3, according to J-STD-020. 50 Max. ramp up 3 °C/s
DRYING
0 10 In case of moisture absorption devices should be baked 0 50 100 150 200 250 300 before soldering. Conditions see J-STD-033D or label. 19841 Time (s) Devices taped on reel dry using recommended conditions Fig. 7 - Lead (Pb)-free Reflow Solder Profile 192 h at 40 °C (+ 5 °C), RH < 5 %. According to J-STD-020
PACKAGE DIMENSIONS
in millimeters R0.26 Optical axis 2 1.12 0.15 0.7 0.95 1.25 Technical drawings 0.225 according to DIN specification 0.2 0.1 0.7 Not indicated tolerances ± 0.1 0.8 0.6 Cathode (VEMD4xxx) Collector (VEMT4xxx) Recommended footprint 0.2 1.3 1.225 0.3 0.475 0.6 Anode (VEMD4xxx) 0.9 Emitter (VEMT4xxx) Drawing-No.: 6.550-5363.01-4 Issue: 2; 01.07.2020 Rev. 1.1, 15-Jul-2020
4
Document Number: 80134 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000