Datasheet ISL9122A (Renesas) - 5
| 制造商 | Renesas |
| 描述 | Ultra-Low IQ Buck-Boost Regulator with Bypass |
| 页数 / 页 | 21 / 5 — Specifications. 2.1. Absolute Maximum Ratings. Parameter. Minimum. … |
| 文件格式/大小 | PDF / 902 Kb |
| 文件语言 | 英语 |
Specifications. 2.1. Absolute Maximum Ratings. Parameter. Minimum. Maximum. Unit. ESD Rating. Value. CAUTION:. 2.2. Thermal Information
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2. Specifications 2.1 Absolute Maximum Ratings Parameter Minimum Maximum Unit
VIN, VOUT -0.3 6.5 V LX1, LX2 -0.3 6.5 V All Other Pins -0.3 6.5 V
ESD Rating Value Unit
Human Body Model (Tested per JS-001-2014) 2 kV Charged Device Model (Tested per JS-002-2014) 1 kV Latch-Up (Tested per JESD78E; Class 2, Level A) 100 mA
CAUTION:
Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely impact product reliability and result in failures not covered by warranty.
2.2 Thermal Information Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) θJB (°C/W)
8 Bump WLCSP Package (Notes 1, 2) 110 - 28 8 Ld 2x3 DFN Package (Notes 1, 3) 72 21 -
Notes:
1. θJA is measured in free air with the component mounted on a high-effective thermal conductivity test board with direct attach features. See TB379 2. For θJB, the board temperature is taken on the board near the edge of the package, on a copper trace at the center of one side. 3. For θJC, the case temperature location is the center of the exposed metal pad on the package underside. See TB379.
Parameter Minimum Maximum Unit
Maximum Junction Temperature +125 °C Storage Temperature Range -65 +150 °C Pb-Free Reflow Profile see TB493
2.3 Recommended Operation Conditions Parameter Minimum Maximum Unit
Ambient Temperature (TA) Range -40 +85 °C Supply Voltage (VIN) Range 1.8 5.5 V Load Current (IOUT) Range (DC) 0 500 mA
2.4 Analog Specifications
VIN = VEN = 3.6V, VOUT = 3.3V, I2C pull-up voltage = VIN, L1 = 1µH, C1 = 10µF, effective C2 = 6µF, TA = +25°C.
Boldface limits apply across the recommended operating temperature range (-40°C to +85°C) and input voltage range (1.8V to 5.5V), unless specified otherwise. Min Max Parameter Symbol Test Conditions (Note 4) Typ (Note 4 ) Unit Power Supply
Input Voltage Range VIN
1.8 5.5
V VIN Undervoltage Lockout Threshold VUVLO VIN Rising
1.79
V Hysteresis 40 mV VIN Quiescent Current IQ VIN = 3.6V, IOUT = 0A (Note 5) 1300
1800
nA FN8947 Rev.1.00 Page 5 of 20 Sep.14.20 Document Outline Features Applications Related Literature Contents 1. Overview 1.1 Block Diagram 1.2 Ordering Information 1.3 Pin Configurations 1.4 Pin Descriptions 2. Specifications 2.1 Absolute Maximum Ratings 2.2 Thermal Information 2.3 Recommended Operation Conditions 2.4 Analog Specifications 2.5 I2C Interface Timing Specifications 3. Typical Performance Curves 4. Functional Description 4.1 Enable Input 4.2 Soft Discharge 4.3 Start-Up 4.4 Overcurrent/Short-Circuit Protection 4.5 Thermal Shutdown 4.6 Buck-Boost Conversion Topology 4.7 PWM Operation 4.8 PFM Operation 4.9 Operation With VIN Close to VOUT 4.10 Forced Operating Modes 4.11 I2C Serial Interface 4.12 Protocol Conventions 4.13 Write Operation 4.14 Read Operation 4.15 Register Descriptions 4.15.1 RO_REG1 4.15.2 INTFLG_REG 4.15.3 VSET 4.15.4 CONV_CFG 4.15.5 INTFLG_MASK 5. Revision History 6. Package Outline Drawings
2. Specifications 2.1 Absolute Maximum Ratings Parameter Minimum Maximum Unit
VIN, VOUT -0.3 6.5 V LX1, LX2 -0.3 6.5 V All Other Pins -0.3 6.5 V
ESD Rating Value Unit
Human Body Model (Tested per JS-001-2014) 2 kV Charged Device Model (Tested per JS-002-2014) 1 kV Latch-Up (Tested per JESD78E; Class 2, Level A) 100 mA
CAUTION:
Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely impact product reliability and result in failures not covered by warranty.
2.2 Thermal Information Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) θJB (°C/W)
8 Bump WLCSP Package (Notes 1, 2) 110 - 28 8 Ld 2x3 DFN Package (Notes 1, 3) 72 21 -
Notes:
1. θJA is measured in free air with the component mounted on a high-effective thermal conductivity test board with direct attach features. See TB379 2. For θJB, the board temperature is taken on the board near the edge of the package, on a copper trace at the center of one side. 3. For θJC, the case temperature location is the center of the exposed metal pad on the package underside. See TB379.
Parameter Minimum Maximum Unit
Maximum Junction Temperature +125 °C Storage Temperature Range -65 +150 °C Pb-Free Reflow Profile see TB493
2.3 Recommended Operation Conditions Parameter Minimum Maximum Unit
Ambient Temperature (TA) Range -40 +85 °C Supply Voltage (VIN) Range 1.8 5.5 V Load Current (IOUT) Range (DC) 0 500 mA
2.4 Analog Specifications
VIN = VEN = 3.6V, VOUT = 3.3V, I2C pull-up voltage = VIN, L1 = 1µH, C1 = 10µF, effective C2 = 6µF, TA = +25°C.
Boldface limits apply across the recommended operating temperature range (-40°C to +85°C) and input voltage range (1.8V to 5.5V), unless specified otherwise. Min Max Parameter Symbol Test Conditions (Note 4) Typ (Note 4 ) Unit Power Supply
Input Voltage Range VIN
1.8 5.5
V VIN Undervoltage Lockout Threshold VUVLO VIN Rising
1.79
V Hysteresis 40 mV VIN Quiescent Current IQ VIN = 3.6V, IOUT = 0A (Note 5) 1300
1800
nA FN8947 Rev.1.00 Page 5 of 20 Sep.14.20 Document Outline Features Applications Related Literature Contents 1. Overview 1.1 Block Diagram 1.2 Ordering Information 1.3 Pin Configurations 1.4 Pin Descriptions 2. Specifications 2.1 Absolute Maximum Ratings 2.2 Thermal Information 2.3 Recommended Operation Conditions 2.4 Analog Specifications 2.5 I2C Interface Timing Specifications 3. Typical Performance Curves 4. Functional Description 4.1 Enable Input 4.2 Soft Discharge 4.3 Start-Up 4.4 Overcurrent/Short-Circuit Protection 4.5 Thermal Shutdown 4.6 Buck-Boost Conversion Topology 4.7 PWM Operation 4.8 PFM Operation 4.9 Operation With VIN Close to VOUT 4.10 Forced Operating Modes 4.11 I2C Serial Interface 4.12 Protocol Conventions 4.13 Write Operation 4.14 Read Operation 4.15 Register Descriptions 4.15.1 RO_REG1 4.15.2 INTFLG_REG 4.15.3 VSET 4.15.4 CONV_CFG 4.15.5 INTFLG_MASK 5. Revision History 6. Package Outline Drawings