Datasheet ADA4800 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | Low Power, High Speed CCD Buffer Amplifier |
| 页数 / 页 | 16 / 5 — ADA4800. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. ISF. EPAD. VEE. … |
| 修订版 | A |
| 文件格式/大小 | PDF / 220 Kb |
| 文件语言 | 英语 |
ADA4800. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. ISF. EPAD. VEE. VCC. OUT. IDRV. NOTES. 1. EXPOSED PAD IS NOT INTERNALLY
该数据表的模型线
文件文字版本
ADA4800 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADA4800 IN 1 6 ISF EPAD VEE 2 5 VCC OUT 3 4 IDRV NOTES
02
1. EXPOSED PAD IS NOT INTERNALLY
0 2-
CONNECTED TO DIE. CONNECT TO ANY LOW
16
IMPEDANCE NODE OR LEAVE FLOATING.
09 Figure 3. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1 IN Input. Connect this pin to the CCD sensor output. 2 VEE Negative Power Supply Voltage. 3 OUT Output. Connect this pin to the AFE input. 4 IDRV Bandwidth Adjustment Pin. Connect this pin to VCC or an external voltage with an external resistor. This pin allows bandwidth to be controlled by adjusting ICC. This pin can also be used to power down the buffer. 5 VCC Positive Power Supply Voltage. 6 ISF Active Load Current Adjustment Pin. Connect to VCC or an external voltage with an external resistor. This pin can also be connected to the microcontroller logic output through an external resistor for power save mode. This pin can also be used to power down the active current load. EPAD EPAD Exposed Pad. Not internally connected to die. Connect to any low impedance node or leave floating. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS BUFFER ELECTRICAL CHARACTERISTICS ACTIVE CURRENT LOAD ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUIT THEORY OF OPERATION SETTING ACTIVE LOAD CURRENT WITH PIN 6 (ISF) SETTING BANDWIDTH WITH PIN 4 (IDRV) APPLICATIONS INFORMATION OPEN SOURCE CCD OUTPUT BUFFER POWER SAVE MODE POWER SUPPLY BYPASSING POWER SEQUENCING OUTLINE DIMENSIONS ORDERING GUIDE
02
1. EXPOSED PAD IS NOT INTERNALLY
0 2-
CONNECTED TO DIE. CONNECT TO ANY LOW
16
IMPEDANCE NODE OR LEAVE FLOATING.
09 Figure 3. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1 IN Input. Connect this pin to the CCD sensor output. 2 VEE Negative Power Supply Voltage. 3 OUT Output. Connect this pin to the AFE input. 4 IDRV Bandwidth Adjustment Pin. Connect this pin to VCC or an external voltage with an external resistor. This pin allows bandwidth to be controlled by adjusting ICC. This pin can also be used to power down the buffer. 5 VCC Positive Power Supply Voltage. 6 ISF Active Load Current Adjustment Pin. Connect to VCC or an external voltage with an external resistor. This pin can also be connected to the microcontroller logic output through an external resistor for power save mode. This pin can also be used to power down the active current load. EPAD EPAD Exposed Pad. Not internally connected to die. Connect to any low impedance node or leave floating. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS BUFFER ELECTRICAL CHARACTERISTICS ACTIVE CURRENT LOAD ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUIT THEORY OF OPERATION SETTING ACTIVE LOAD CURRENT WITH PIN 6 (ISF) SETTING BANDWIDTH WITH PIN 4 (IDRV) APPLICATIONS INFORMATION OPEN SOURCE CCD OUTPUT BUFFER POWER SAVE MODE POWER SUPPLY BYPASSING POWER SEQUENCING OUTLINE DIMENSIONS ORDERING GUIDE