Datasheet AD8001 (Analog Devices) - 3

AD8001 ABSOLUTE MAXIMUM RATINGS1 MAXIMUM POWER DISSIPATION
Supply Voltage . 12.6 V The maximum power that can be safely dissipated by the Internal Power Dissipation @ 25°C2 AD8001 is limited by the associated rise in junction tempera- PDIP Package (N) . 1.3 W ture. The maximum safe junction temperature for plastic SOIC (R) . 0.8 W encapsulated devices is determined by the glass transition tem- 8-Lead CERDIP . 1.1 W perature of the plastic, approximately 150°C. Exceeding this SOT-23-5 Package (RT) . 0.5 W limit temporarily may cause a shift in parametric performance Input Voltage (Common Mode) . ± VS due to a change in the stresses exerted on the die by the package. Differential Input Voltage . ± 1.2 V Exceeding a junction temperature of 175°C for an extended Output Short Circuit Duration period can result in device failure. Observe Power Derating Curves While the AD8001 is internally short circuit protected, this Storage Temperature Range N, R . –65°C to +125°C may not be sufficient to guarantee that the maximum junction Operating Temperature Range (A Grade) . – 40°C to +85°C temperature (150°C) is not exceeded under all conditions. To Lead Temperature Range (Soldering 10 sec) . 300°C ensure proper operation, it is necessary to observe the maximum NOTES power derating curves. 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the
2.0
device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating
8-LEAD TJ = +150 C
conditions for extended periods may affect device reliability.
PDIP PACKAGE
2Specification is for device in free air:
1.5 8-LEAD
8-Lead PDIP Package: θJA = 90°C/W
8-LEAD CERDIP PACKAGE
8-Lead SOIC Package: θJA = 155°C/W
SOIC PACKAGE
8-Lead CERDIP Package: θJA = 110°C/W 5-Lead SOT-23-5 Package: θJA = 260°C/W
1.0 0.5 5-LEAD MAXIMUM POWER DISSIPATION – W SOT-23-5 PACKAGE 0 –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE – C
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ORDERING GUIDE Temperature Package Package Model Range Description Option Branding
AD8001AN –40°C to +85°C 8-Lead PDIP N-8 AD8001AQ –55°C to +125°C 8-Lead CERDIP Q-8 AD8001AR –40°C to +85°C 8-Lead SOIC R-8 AD8001AR-REEL –40°C to +85°C 13" Tape and REEL R-8 AD8001AR-REEL7 –40°C to +85°C 7" Tape and REEL R-8 AD8001ART-REEL –40°C to +85°C 13" Tape and REEL RT-5 HEA AD8001ART-REEL7 –40°C to +85°C 7" Tape and REEL RT-5 HEA AD8001ACHIPS –40°C to +85°C Die Form 5962-9459301MPA* –55°C to +125°C 8-Lead CERDIP Q-8 *Standard Military Drawing Device.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD8001 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality. REV. D –3– Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE MAXIMUM POWER DISSIPATION Typical Performance Characteristics THEORY OF OPERATION Choice of Feedback and Gain Resistors Printed Circuit Board Layout Considerations Power Supply Bypassing DC Errors and Noise Driving Capacitive Loads Communications Operation as a Video Line Driver Driving A-to-D Converters Layout Considerations OUTLINE DIMENSIONS Revision History