Datasheet AD810 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | Low Power Video Op Amp with Disable |
| 页数 / 页 | 22 / 5 — Data Sheet. AD810. ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER … |
| 修订版 | B |
| 文件格式/大小 | PDF / 472 Kb |
| 文件语言 | 英语 |
Data Sheet. AD810. ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER DISSIPATION. Parameter. Rating. 2.4. 2.2. 8-LEAD. PDIP. 2.0. 1.8. TION A. 1.6
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Data Sheet AD810 ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER DISSIPATION Parameter Rating
The maximum power that can be safely dissipated by the AD810 is Supply Voltage ±18 V limited by the associated rise in junction temperature. To ensure Internal Power Dissipation See Figure 2 proper operation, it is important to observe the derating curves Output Short-Circuit Duration1 See Figure 2 in Figure 2. Common-Mode Input Voltage ±VS
2.4
Differential Input Voltage ±6 V
2.2 8-LEAD
Storage Temperature Range
PDIP W) 2.0
PDIP −65°C to +125°C
( 1.8
CERDIP −65°C to +150°C
TION A
SOIC_N −65°C to +125°C
IP 1.6 S IS
Operating Temperature Range
1.4 D R
AD810A −40°C to +85°C
1.2 OWE 8-LEAD
5962-9313201MPA −55°C to +125°C
CERDIP L P 1.0 8-LEAD
Junction Temperature
SOIC 0.8
AD810A 145°C
TOTA 0.6
5962-9313201MPA 175°C Lead Temperature Range (Soldering 300°C
0.4 –60 –40 –20 0 20 40 60 80 100 120 140
002 60 sec)
AMBIENT TEMPERATURE (°C)
1737- Figure 2. Total Power Dissipation vs. Ambient Temperature 1 Internal short-circuit protection may not be sufficient to guarantee that the maximum junction temperature is not exceeded under all conditions.
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one-cubic foot sealed enclosure.
Table 3. Thermal Resistance Package Type θJA Unit
N-8 90 °C/W Q-8 110 °C/W R-8 150 °C/W Rev. B | Page 5 of 22 Document Outline FEATURES APPLICATIONS CONNECTION DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION GENERAL DESIGN CONSIDERATIONS ACHIEVING VERY FLAT GAIN RESPONSE AT HIGH FREQUENCY CHOICE OF FEEDBACK RESISTOR PRINTED CIRCUIT BOARD LAYOUT QUALITY OF COAXIAL CABLE POWER SUPPLY BYPASSING POWER SUPPLY OPERATING RANGE OFFSET NULLING DISABLE MODE APPLICATIONS INFORMATION CAPACITIVE LOADS OPERATION AS A VIDEO LINE DRIVER 2:1 VIDEO MULTIPLEXER 4:1 MULTIPLEXER OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet AD810 ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER DISSIPATION Parameter Rating
The maximum power that can be safely dissipated by the AD810 is Supply Voltage ±18 V limited by the associated rise in junction temperature. To ensure Internal Power Dissipation See Figure 2 proper operation, it is important to observe the derating curves Output Short-Circuit Duration1 See Figure 2 in Figure 2. Common-Mode Input Voltage ±VS
2.4
Differential Input Voltage ±6 V
2.2 8-LEAD
Storage Temperature Range
PDIP W) 2.0
PDIP −65°C to +125°C
( 1.8
CERDIP −65°C to +150°C
TION A
SOIC_N −65°C to +125°C
IP 1.6 S IS
Operating Temperature Range
1.4 D R
AD810A −40°C to +85°C
1.2 OWE 8-LEAD
5962-9313201MPA −55°C to +125°C
CERDIP L P 1.0 8-LEAD
Junction Temperature
SOIC 0.8
AD810A 145°C
TOTA 0.6
5962-9313201MPA 175°C Lead Temperature Range (Soldering 300°C
0.4 –60 –40 –20 0 20 40 60 80 100 120 140
002 60 sec)
AMBIENT TEMPERATURE (°C)
1737- Figure 2. Total Power Dissipation vs. Ambient Temperature 1 Internal short-circuit protection may not be sufficient to guarantee that the maximum junction temperature is not exceeded under all conditions.
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one-cubic foot sealed enclosure.
Table 3. Thermal Resistance Package Type θJA Unit
N-8 90 °C/W Q-8 110 °C/W R-8 150 °C/W Rev. B | Page 5 of 22 Document Outline FEATURES APPLICATIONS CONNECTION DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION GENERAL DESIGN CONSIDERATIONS ACHIEVING VERY FLAT GAIN RESPONSE AT HIGH FREQUENCY CHOICE OF FEEDBACK RESISTOR PRINTED CIRCUIT BOARD LAYOUT QUALITY OF COAXIAL CABLE POWER SUPPLY BYPASSING POWER SUPPLY OPERATING RANGE OFFSET NULLING DISABLE MODE APPLICATIONS INFORMATION CAPACITIVE LOADS OPERATION AS A VIDEO LINE DRIVER 2:1 VIDEO MULTIPLEXER 4:1 MULTIPLEXER OUTLINE DIMENSIONS ORDERING GUIDE