Datasheet MYTNA1R84RELA2RA (Murata) - 3

MYTNA1R84RELA2RA
Document Category: Datasheet UltraBK™ 4A DC–DC Converter Module
Absolute Maximum Ratings(1)(2) PARAMETER MIN MAX UNITS
Vin, ON/OFF Pin
(3)
-0.3 16 V Trim
(4)
, POK Pin -0.3 5.5 V Storage Temperature -40 125 °C Soldering / Reflow temperature
(5)
- 260 °C ESD Tolerance, HBM
(6)
- 1000 V Notes: (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to absolute maximum rating conditions for extended periods may extremely reduce device reliability. (2) All voltages are with respect to GND plane. (3) Do NOT exceed more than 0.3V from Vin voltage. (4) The Trim pin is designed to be connected to GND via a resistor. (5) Recommended Reflow profile is written in “Soldering Guidelines”. (6) Human body model, per the JEDEC standard JS-001-2012.
Table 1. Absolute Maximum Ratings Recommended Operating Conditions
(1)
PARAMETER MIN MAX UNITS
Input Voltage Range 6.0 14.4 V Ambient Temperature
(2)
-40 105 °C Junction Temperature -40 120 °C Load Current 0 4 A Notes: (1) This module should be operated inside the recommended operating conditions. This module has been designed and tested on the assumption that it will be used under the recommended operating conditions. Operating in not recommended condition may reduce reliability of the module. (2) See the temperature derating curves in the thermal deratings. However, do not condensate.
Table 2. Recommended Operating Conditions Package Thermal Characteristics(1)(2) PARAMETER TYP UNITS
Θjcb-1 Junction-case-bottom at heat Junction1 10.0 °C/W Θjcb-2 Junction-case-bottom at heat Junction2 47.3 °C/W Θjct-1 Junction-case-top a heat Junction1 64.9 °C/W Θjct-2 Junction-case-top a heat Junction2 53.7 °C/W Θja Junction-air 19.9 °C/W Notes: (1) Package thermal characteristics and performance are acquire and reported in according to the JEDEC standard JESD51-12. See “Fig.34” below for more information on our measurement conditions. (2) Junction thermal resistance is a function not only of the internal parts, but it is also extremely sensitive to the environment which includes, but is not limited to, board thickness, number of layers, copper weight / routes, and air flow. Attention to the board layout is necessary to realize expected thermal performance.
Table 3. Package Thermal Characteristics http://www.murata.com/products/power
Copyright ©2020 Murata Manufacturing Co., Ltd. All rights reserved. Export Control Code : X0863 Document No :D90DH – 00072 MYTNA1R84RELA2RA A01 Page 3 of 26 Document Outline Product Description Features Typical Applications Efficiency Simplified Application Circuit Absolute Maximum Ratings(1)(2) Recommended Operating Conditions(1) Package Thermal Characteristics(1)(2) Electrical Characteristics Pin Configuration Pin Descriptions Functional Block Diagram Typical Performance Characteristics Thermal Deratings (Reference Data) Output Voltage Range Limitation of Input Voltage Slew rate Detailed Description Output Voltage Adjustment Resistor Trim Equation Output Voltage Remote Sense Function Remote Enable Function Soft start Function Power Good Operation Protections Over Current Protection and Short Circuit Protection Over Temperature Protection Soldering Guidelines Pb-free Solder Processes Dry Pack Information Application Performance Transient Performance Test Circuit Component Selection Input Fuse Input Capacitor Output Capacitor Packaging Information Moisture Sensitivity Level Package Drawing Recommended Board Land Pattern (Top View) Top Marking Specification Application Circuit Application Circuit Part List (Recommended) Application Board Example Tape and Reel Specification Order Codes Notices CAUTION Limitation of Applications Note Product Specification Sales contact Disclaimers Patent Statement Copyright and Trademark