Datasheet SLG46824 (Dialog Semiconductor) - 3
| 制造商 | Dialog Semiconductor |
| 描述 | GreenPAK Programmable Mixed-signal Matrix with In System Programmability |
| 页数 / 页 | 171 / 3 — SLG46824. GreenPAK Programmable Mixed-Signal Matrix with In System … |
| 文件格式/大小 | PDF / 2.8 Mb |
| 文件语言 | 英语 |
SLG46824. GreenPAK Programmable Mixed-Signal Matrix with In System Programmability. 14 Power-On Reset .. 102. 15 I
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SLG46824 GreenPAK Programmable Mixed-Signal Matrix with In System Programmability
13.2 Oscillator0 (2.048 kHz) ...93 13.3 Oscillator1 (2.048 MHz) ...94 13.4 Oscillator2 (25 MHz) ..95 13.5 CNT/DLY Clock Scheme ..96 13.6 External Clocking ...96 13.7 Oscillators Power-On Delay ...97 13.8 Oscillators Accuracy ...99
14 Power-On Reset .. 102
14.1 General Operation ..102 14.2 POR Sequence ..103 14.3 Macrocells Output States During POR Sequence ...103
15 I
2
C Serial Communications Macrocell .. 106
15.1 I2C Serial Communications Macrocell Overview ..106 15.2 I2C Serial Communications Device Addressing ...106 15.3 I2C Serial General Timing ..107 15.4 I2C Serial Communications Commands ...107 15.5 Chip Configuration Data Protection ..110 15.6 I2C Serial Command Register Map ...111 15.7 I2C Additional Options ..112
16 Non-Volatile Memory .. 115
16.1 Serial NVM Write Operations ...115 16.2 Serial NVM Read Operations ...117 16.3 Serial NVM Erase Operations ..117
17 Register Definitions ... 118
17.1 Register Map ..118
18 Package Top Marking System Definition ... 160
18.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package ..160 18.2 TSSOP-20 ...160
19 Package Information .. 161
19.1 Package outlines for STQFN 20L 2 mm x 3 mm 0.4P FCD ...161 19.2 Package outlines for TSSOP 20L 173 MIL Green ..162 19.3 STQFN and TSSOP Handling ..163 19.4 Soldering Information ...163
20 Ordering Information ... 163
20.1 Tape and Reel Specifications ..163 20.2 Carrier Tape Drawing and Dimensions ..163 20.3 STQFN-20L ..164 20.4 TSSOP-20L ..164
21 Layout Guidelines .. 165
21.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package ...165 21.2 TSSOP-20 ..166
Glossary .. 167 Revision History ... 170 Datasheet Revision 3.10 10-Mar-2020
CFR0011-120-00 3 of 171 © 2020 Dialog Semiconductor Document Outline General Description Key Features Applications 1 Block Diagram 2 Pinout 2.1 Pin Configuration - STQFN- 20L 2.2 Pin Configuration - TSSOP-20L 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Electrostatic Discharge Ratings 3.3 Recommended Operating Conditions 3.4 Electrical Characteristics 3.5 Timing Characteristics 3.6 OSC Characteristics 3.6.1 OSC Specifications 3.6.2 OSC Power-On Delay 3.7 ACMP Specifications 4 User Programmability 5 IO Pins 5.1 IO Pins 5.2 GPIO Pins 5.3 GPO Pins 5.4 GPI Pins 5.5 Pull-Up/Down Resistors 5.6 Fast Pull-up/down during Power-up 5.7 I2C Mode IO Structure (VDD or VDD2) 5.7.1 I2C Mode Structure (for SCL and SDA) 5.8 Matrix OE IO Structure (VDD or VDD2) 5.8.1 Matrix OE IO Structure (for IOs 1, 4, 5 with VDD, and IOs 8, 9, 10, 11, 12, 13, 14 with VDD2) 5.9 Register OE IO Structure (VDD or VDD2) 5.9.1 Register OE IO Structure (for IOs 0, 2, 3 with VDD) 5.10 Register OE IO Structure (VDD or VDD2) 5.10.1 Register OE IO Structure (for IO 6 with VDD, and IO 7 with VDD2) 5.11 IO Typical Performance 6 Connection Matrix 6.1 Matrix Input Table 6.2 Matrix Output Table 6.3 Connection Matrix Virtual Inputs 6.4 Connection Matrix Virtual Outputs 7 Combination Function Macrocells 7.1 2-Bit LUT or D Flip-Flop Macrocells 7.1.1 2-Bit LUT or D Flip-Flop Macrocell Used as 2-Bit LUTT 7.1.2 Initial Polarity Operations 7.2 2-bit LUT or Programmable Pattern Generator 7.2.1 2-Bit LUT or PGen Macrocell Used as 2-Bit LUT 7.3 3-Bit LUT or D Flip-Flop with Set/Reset Macrocells 7.3.1 3-Bit LUT or D Flip-Flop Macrocells Used as 3-Bit LUTs 7.3.2 Initial Polarity Operations 7.4 3-Bit LUT or Pipe Delay/Ripple Counter Macrocell 7.4.1 3-Bit LUT or Pipe Delay Macrocells Used as 3-Bit LUT 8 Multi-Function Macrocells 8.1 3-Bit LUT or DFF/LATCH with 8-Bit Counter/Delay Macrocells 8.1.1 3-Bit LUT or 8-Bit CNT/DLY Block Diagrams 8.1.2 3-Bit LUT or CNT/DLYs Used as 3-Bit LUTs 8.2 CNT/DLY/FSM Timing Diagrams 8.2.1 Delay Mode CNT/DLY0 to CNT/DLY7 8.2.2 Count Mode (Count Data: 3), Counter Reset (Rising Edge Detect) CNT/DLY0 to CNT/DLY7 8.2.3 One-Shot Mode CNT/DLY0 to CNT/DLY7 8.2.4 Frequency Detection Mode CNT/DLY0 to CNT/DLY7 8.2.5 Edge Detection Mode CNT/DLY1 to CNT/DLY7 8.2.6 Delayed Edge Detection Mode CNT/DLY0 to CNT/DLY7 8.2.7 CNT/FSM Mode CNT/DLY0 8.2.8 Difference in Counter Value for Counter, Delay, One-Shot, and Frequency Detect Modes 8.3 4-Bit LUT or DFF/LATCH with 16-Bit Counter/Delay Macrocell 8.3.1 4-Bit LUT or 16-Bit CNT/DLY Block Diagram 8.3.2 4-Bit LUT or 16-Bit Counter/Delay Macrocells Used as 4-Bit LUTs 9 Analog Comparators 9.1 ACMP0L Block Diagram 9.2 ACMP1L Block Diagram 9.3 ACMP Typical Performance 10 Programmable Delay/Edge Detector 10.1 Programmable Delay Timing Diagram - Edge Detector Output 11 Additional Logic Function. Deglitch Filter 12 Voltage Reference 12.1 Voltage Reference Overview 12.2 Vref Selection Table 12.3 Vref Block Diagram 12.4 VREF Load Regulation 13 Clocking 13.1 Oscillator general description 13.2 Oscillator0 (2.048 kHz) 13.3 Oscillator1 (2.048 MHz) 13.4 Oscillator2 (25 MHz) 13.5 CNT/DLY Clock Scheme 13.6 External Clocking 13.6.1 IO0 Source for Oscillator0 (2.048 kHz) 13.6.2 IO10 Source for Oscillator1 (2.048 MHz) 13.6.3 IO8 Source for Oscillator2 (25 MHz) 13.7 Oscillators Power-On Delay 13.8 Oscillators Accuracy 14 Power-On Reset 14.1 General Operation 14.2 POR Sequence 14.3 Macrocells Output States During POR Sequence 14.3.1 Initialization 14.3.2 Power-Down 15 I2C Serial Communications Macrocell 15.1 I2C Serial Communications Macrocell Overview 15.2 I2C Serial Communications Device Addressing 15.3 I2C Serial General Timing 15.4 I2C Serial Communications Commands 15.4.1 Byte Write Command 15.4.2 Sequential Write Command 15.4.3 Current Address Read Command 15.4.4 Random Read Command 15.4.5 Sequential Read Command 15.4.6 I2C Serial Reset Command 15.5 Chip Configuration Data Protection 15.6 I2C Serial Command Register Map 15.7 I2C Additional Options 15.7.1 Reading Counter Data via I2C 15.7.2 I2C Expander 15.7.3 I2C Byte Write Bit Masking 16 Non-Volatile Memory 16.1 Serial NVM Write Operations 16.2 Serial NVM Read Operations 16.3 Serial NVM Erase Operations 17 Register Definitions 17.1 Register Map 18 Package Top Marking System Definition 18.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 18.2 TSSOP-20 19 Package Information 19.1 Package outlines for STQFN 20L 2 mm x 3 mm 0.4P FCD 19.2 Package outlines for TSSOP 20L 173 MIL Green 19.3 STQFN and TSSOP Handling 19.4 Soldering Information 20 Ordering Information 20.1 Tape and Reel Specifications 20.2 Carrier Tape Drawing and Dimensions 20.3 STQFN-20L 20.4 TSSOP-20L 21 Layout Guidelines 21.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 21.2 TSSOP-20 Glossary Revision History
SLG46824 GreenPAK Programmable Mixed-Signal Matrix with In System Programmability
13.2 Oscillator0 (2.048 kHz) ...93 13.3 Oscillator1 (2.048 MHz) ...94 13.4 Oscillator2 (25 MHz) ..95 13.5 CNT/DLY Clock Scheme ..96 13.6 External Clocking ...96 13.7 Oscillators Power-On Delay ...97 13.8 Oscillators Accuracy ...99
14 Power-On Reset .. 102
14.1 General Operation ..102 14.2 POR Sequence ..103 14.3 Macrocells Output States During POR Sequence ...103
15 I
2
C Serial Communications Macrocell .. 106
15.1 I2C Serial Communications Macrocell Overview ..106 15.2 I2C Serial Communications Device Addressing ...106 15.3 I2C Serial General Timing ..107 15.4 I2C Serial Communications Commands ...107 15.5 Chip Configuration Data Protection ..110 15.6 I2C Serial Command Register Map ...111 15.7 I2C Additional Options ..112
16 Non-Volatile Memory .. 115
16.1 Serial NVM Write Operations ...115 16.2 Serial NVM Read Operations ...117 16.3 Serial NVM Erase Operations ..117
17 Register Definitions ... 118
17.1 Register Map ..118
18 Package Top Marking System Definition ... 160
18.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package ..160 18.2 TSSOP-20 ...160
19 Package Information .. 161
19.1 Package outlines for STQFN 20L 2 mm x 3 mm 0.4P FCD ...161 19.2 Package outlines for TSSOP 20L 173 MIL Green ..162 19.3 STQFN and TSSOP Handling ..163 19.4 Soldering Information ...163
20 Ordering Information ... 163
20.1 Tape and Reel Specifications ..163 20.2 Carrier Tape Drawing and Dimensions ..163 20.3 STQFN-20L ..164 20.4 TSSOP-20L ..164
21 Layout Guidelines .. 165
21.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package ...165 21.2 TSSOP-20 ..166
Glossary .. 167 Revision History ... 170 Datasheet Revision 3.10 10-Mar-2020
CFR0011-120-00 3 of 171 © 2020 Dialog Semiconductor Document Outline General Description Key Features Applications 1 Block Diagram 2 Pinout 2.1 Pin Configuration - STQFN- 20L 2.2 Pin Configuration - TSSOP-20L 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Electrostatic Discharge Ratings 3.3 Recommended Operating Conditions 3.4 Electrical Characteristics 3.5 Timing Characteristics 3.6 OSC Characteristics 3.6.1 OSC Specifications 3.6.2 OSC Power-On Delay 3.7 ACMP Specifications 4 User Programmability 5 IO Pins 5.1 IO Pins 5.2 GPIO Pins 5.3 GPO Pins 5.4 GPI Pins 5.5 Pull-Up/Down Resistors 5.6 Fast Pull-up/down during Power-up 5.7 I2C Mode IO Structure (VDD or VDD2) 5.7.1 I2C Mode Structure (for SCL and SDA) 5.8 Matrix OE IO Structure (VDD or VDD2) 5.8.1 Matrix OE IO Structure (for IOs 1, 4, 5 with VDD, and IOs 8, 9, 10, 11, 12, 13, 14 with VDD2) 5.9 Register OE IO Structure (VDD or VDD2) 5.9.1 Register OE IO Structure (for IOs 0, 2, 3 with VDD) 5.10 Register OE IO Structure (VDD or VDD2) 5.10.1 Register OE IO Structure (for IO 6 with VDD, and IO 7 with VDD2) 5.11 IO Typical Performance 6 Connection Matrix 6.1 Matrix Input Table 6.2 Matrix Output Table 6.3 Connection Matrix Virtual Inputs 6.4 Connection Matrix Virtual Outputs 7 Combination Function Macrocells 7.1 2-Bit LUT or D Flip-Flop Macrocells 7.1.1 2-Bit LUT or D Flip-Flop Macrocell Used as 2-Bit LUTT 7.1.2 Initial Polarity Operations 7.2 2-bit LUT or Programmable Pattern Generator 7.2.1 2-Bit LUT or PGen Macrocell Used as 2-Bit LUT 7.3 3-Bit LUT or D Flip-Flop with Set/Reset Macrocells 7.3.1 3-Bit LUT or D Flip-Flop Macrocells Used as 3-Bit LUTs 7.3.2 Initial Polarity Operations 7.4 3-Bit LUT or Pipe Delay/Ripple Counter Macrocell 7.4.1 3-Bit LUT or Pipe Delay Macrocells Used as 3-Bit LUT 8 Multi-Function Macrocells 8.1 3-Bit LUT or DFF/LATCH with 8-Bit Counter/Delay Macrocells 8.1.1 3-Bit LUT or 8-Bit CNT/DLY Block Diagrams 8.1.2 3-Bit LUT or CNT/DLYs Used as 3-Bit LUTs 8.2 CNT/DLY/FSM Timing Diagrams 8.2.1 Delay Mode CNT/DLY0 to CNT/DLY7 8.2.2 Count Mode (Count Data: 3), Counter Reset (Rising Edge Detect) CNT/DLY0 to CNT/DLY7 8.2.3 One-Shot Mode CNT/DLY0 to CNT/DLY7 8.2.4 Frequency Detection Mode CNT/DLY0 to CNT/DLY7 8.2.5 Edge Detection Mode CNT/DLY1 to CNT/DLY7 8.2.6 Delayed Edge Detection Mode CNT/DLY0 to CNT/DLY7 8.2.7 CNT/FSM Mode CNT/DLY0 8.2.8 Difference in Counter Value for Counter, Delay, One-Shot, and Frequency Detect Modes 8.3 4-Bit LUT or DFF/LATCH with 16-Bit Counter/Delay Macrocell 8.3.1 4-Bit LUT or 16-Bit CNT/DLY Block Diagram 8.3.2 4-Bit LUT or 16-Bit Counter/Delay Macrocells Used as 4-Bit LUTs 9 Analog Comparators 9.1 ACMP0L Block Diagram 9.2 ACMP1L Block Diagram 9.3 ACMP Typical Performance 10 Programmable Delay/Edge Detector 10.1 Programmable Delay Timing Diagram - Edge Detector Output 11 Additional Logic Function. Deglitch Filter 12 Voltage Reference 12.1 Voltage Reference Overview 12.2 Vref Selection Table 12.3 Vref Block Diagram 12.4 VREF Load Regulation 13 Clocking 13.1 Oscillator general description 13.2 Oscillator0 (2.048 kHz) 13.3 Oscillator1 (2.048 MHz) 13.4 Oscillator2 (25 MHz) 13.5 CNT/DLY Clock Scheme 13.6 External Clocking 13.6.1 IO0 Source for Oscillator0 (2.048 kHz) 13.6.2 IO10 Source for Oscillator1 (2.048 MHz) 13.6.3 IO8 Source for Oscillator2 (25 MHz) 13.7 Oscillators Power-On Delay 13.8 Oscillators Accuracy 14 Power-On Reset 14.1 General Operation 14.2 POR Sequence 14.3 Macrocells Output States During POR Sequence 14.3.1 Initialization 14.3.2 Power-Down 15 I2C Serial Communications Macrocell 15.1 I2C Serial Communications Macrocell Overview 15.2 I2C Serial Communications Device Addressing 15.3 I2C Serial General Timing 15.4 I2C Serial Communications Commands 15.4.1 Byte Write Command 15.4.2 Sequential Write Command 15.4.3 Current Address Read Command 15.4.4 Random Read Command 15.4.5 Sequential Read Command 15.4.6 I2C Serial Reset Command 15.5 Chip Configuration Data Protection 15.6 I2C Serial Command Register Map 15.7 I2C Additional Options 15.7.1 Reading Counter Data via I2C 15.7.2 I2C Expander 15.7.3 I2C Byte Write Bit Masking 16 Non-Volatile Memory 16.1 Serial NVM Write Operations 16.2 Serial NVM Read Operations 16.3 Serial NVM Erase Operations 17 Register Definitions 17.1 Register Map 18 Package Top Marking System Definition 18.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 18.2 TSSOP-20 19 Package Information 19.1 Package outlines for STQFN 20L 2 mm x 3 mm 0.4P FCD 19.2 Package outlines for TSSOP 20L 173 MIL Green 19.3 STQFN and TSSOP Handling 19.4 Soldering Information 20 Ordering Information 20.1 Tape and Reel Specifications 20.2 Carrier Tape Drawing and Dimensions 20.3 STQFN-20L 20.4 TSSOP-20L 21 Layout Guidelines 21.1 STQFN 20L 2 mm x 3 mm 0.4P FCD Package 21.2 TSSOP-20 Glossary Revision History