Datasheet STM32WB5MMG (STMicroelectronics) - 10
| 制造商 | STMicroelectronics |
| 描述 | Bluetooth Low Energy 5.0 and 802.15.4 module |
| 页数 / 页 | 31 / 10 — STM32WB5MMG. Layout recommendations. 5.2. 5.2.1. STM32WB5MMG placement. … |
| 文件格式/大小 | PDF / 3.7 Mb |
| 文件语言 | 英语 |
STM32WB5MMG. Layout recommendations. 5.2. 5.2.1. STM32WB5MMG placement. Figure 4. STM32WB5MMG board placement. 5.2.2
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STM32WB5MMG Layout recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement
The embedded antenna manufacturer of the STM32WB5MMG recommends to place the module on the application board as shown below.
Figure 4. STM32WB5MMG board placement
This position allows the antenna to work to its maximum performance. If it cannot be placed as recommended above, the application board performance is be reduced. This does not, however, prevent correct operation.
5.2.2 Enclosure effects
Product casing properties must be also considered when designing an RF-enabled product as the following list illustrated; • Conductive enclosure in close proximity (in far-field) of the antenna reflects the radiating signal and thus decreases the transmitting / receiving power. If there has to be a metal part in the enclosure, consider a frame rather than a box. • Conductive enclosure in the near field affects the impedance of the antenna, also the resonant frequency. A metal case must not be in the near field. The threshold between near and far-field is provided in Figure 5. • Plastic enclosures can be close to the antenna, but must not touch it. Contact between the casing and the antenna may influence the tuning of the resonant frequency and impedance matching. • The proximity of the human body attenuates the TX and RX signals due to a certain amount of water content. Any contact may untune frequency and impedance matching.
DS13252
-
Rev 1 page 10/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures
STM32WB5MMG Layout recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement
The embedded antenna manufacturer of the STM32WB5MMG recommends to place the module on the application board as shown below.
Figure 4. STM32WB5MMG board placement
This position allows the antenna to work to its maximum performance. If it cannot be placed as recommended above, the application board performance is be reduced. This does not, however, prevent correct operation.
5.2.2 Enclosure effects
Product casing properties must be also considered when designing an RF-enabled product as the following list illustrated; • Conductive enclosure in close proximity (in far-field) of the antenna reflects the radiating signal and thus decreases the transmitting / receiving power. If there has to be a metal part in the enclosure, consider a frame rather than a box. • Conductive enclosure in the near field affects the impedance of the antenna, also the resonant frequency. A metal case must not be in the near field. The threshold between near and far-field is provided in Figure 5. • Plastic enclosures can be close to the antenna, but must not touch it. Contact between the casing and the antenna may influence the tuning of the resonant frequency and impedance matching. • The proximity of the human body attenuates the TX and RX signals due to a certain amount of water content. Any contact may untune frequency and impedance matching.
DS13252
-
Rev 1 page 10/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures