Datasheet IRFP450, SiHFP450 (Vishay) - 8
| 制造商 | Vishay |
| 描述 | Power MOSFET |
| 页数 / 页 | 11 / 8 — Package Information. TO-247AC (High Voltage). VERSION 1: FACILITY CODE = … |
| 文件格式/大小 | PDF / 1.6 Mb |
| 文件语言 | 英语 |
Package Information. TO-247AC (High Voltage). VERSION 1: FACILITY CODE = 9. MILLIMETERS. DIM. MIN. MAX. NOTES. Notes
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Package Information
www.vishay.com Vishay Siliconix
TO-247AC (High Voltage) VERSION 1: FACILITY CODE = 9 MILLIMETERS MILLIMETERS DIM. MIN. MAX. NOTES DIM. MIN. MAX. NOTES
A 4.83 5.21 D1 16.25 16.85 5 A1 2.29 2.55 D2 0.56 0.76 A2 1.50 2.49 E 15.50 15.87 4 b 1.12 1.33 E1 13.46 14.16 5 b1 1.12 1.28 E2 4.52 5.49 3 b2 1.91 2.39 6 e 5.44 BSC b3 1.91 2.34 L 14.90 15.40 b4 2.87 3.22 6, 8 L1 3.96 4.16 6 b5 2.87 3.18 Ø P 3.56 3.65 7 c 0.55 0.69 6 Ø P1 7.19 ref. c1 0.55 0.65 Q 5.31 5.69 D 20.40 20.70 4 S 5.54 5.74
Notes
(1) Package reference: JEDEC® TO247, variation AC (2) All dimensions are in mm (3) Slot required, notch may be rounded (4) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outermost extremes of the plastic body (5) Thermal pad contour optional with dimensions D1 and E1 (6) Lead finish uncontrolled in L1 (7) Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm (8) Dimension b2 and b4 does not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4 dimension at maximum material condition Revision: 19-Oct-2020
1
Document Number: 91360 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Siliconix
TO-247AC (High Voltage) VERSION 1: FACILITY CODE = 9 MILLIMETERS MILLIMETERS DIM. MIN. MAX. NOTES DIM. MIN. MAX. NOTES
A 4.83 5.21 D1 16.25 16.85 5 A1 2.29 2.55 D2 0.56 0.76 A2 1.50 2.49 E 15.50 15.87 4 b 1.12 1.33 E1 13.46 14.16 5 b1 1.12 1.28 E2 4.52 5.49 3 b2 1.91 2.39 6 e 5.44 BSC b3 1.91 2.34 L 14.90 15.40 b4 2.87 3.22 6, 8 L1 3.96 4.16 6 b5 2.87 3.18 Ø P 3.56 3.65 7 c 0.55 0.69 6 Ø P1 7.19 ref. c1 0.55 0.65 Q 5.31 5.69 D 20.40 20.70 4 S 5.54 5.74
Notes
(1) Package reference: JEDEC® TO247, variation AC (2) All dimensions are in mm (3) Slot required, notch may be rounded (4) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outermost extremes of the plastic body (5) Thermal pad contour optional with dimensions D1 and E1 (6) Lead finish uncontrolled in L1 (7) Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm (8) Dimension b2 and b4 does not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4 dimension at maximum material condition Revision: 19-Oct-2020
1
Document Number: 91360 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000