link to page 2 link to page 2 link to page 2 link to page 2 MBR0540T1G, NRVB0540T1G, MBR0540T3G, NRVB0540T3GMAXIMUM RATINGSRatingSymbolValueUnit Peak Repetitive Reverse Voltage VRRM 40 V Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Average Rectified Forward Current IO A (At Rated VR, TC = 115C) 0.5 Peak Repetitive Forward Current IFRM A (At Rated VR, Square Wave, 20 kHz, TC = 115C) 1.0 Non−Repetitive Peak Surge Current IFSM A (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) 5.5 Storage/Operating Case Temperature Range Tstg, TC −55 to +150 C Operating Junction Temperature TJ −55 to +150 C Voltage Rate of Change dv/dt V/ms (Rated VR, TJ = 25C) 1000 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICSCharacteristicSymbolValueUnit Thermal Resistance − Junction−to−Lead (Note 1) Rtjl 118 C/W Thermal Resistance − Junction−to−Ambient (Note 2) Rtja 206 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 X 0.5 inch for each lead) on FR4 board. ELECTRICAL CHARACTERISTICSCharacteristicSymbolValueUnit Maximum Instantaneous Forward Voltage (Note 3) vF TJ = 25CTJ = 100C V (iF = 0.5 A) 0.51 0.46 (iF = 1 A) 0.62 0.61 Maximum Instantaneous Reverse Current (Note 3) IR TJ = 25CTJ = 100C mA (VR = 40 V) 20 13,000 (VR = 20 V) 10 5,000 3. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0%. 100 10 10 (AMPS) (AMPS) 25C ARD CURRENT ARD CURRENT W 1.0 W 1.0 TJ = 125C TJ = -40C TJ = 125C ANEOUS FOR TJ = 25C ANEOUS FOR TJ = 100C ANT ANT TJ = 100C TJ = 25C , INST 0.1 , INST 0.1 i F 0.2 0.4 0.6 0.8 1.0 1.2 I F 0.2 0.4 0.6 0.8 1.0 1.2 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward VoltageFigure 2. Maximum Forward Voltagehttp://onsemi.com2