Datasheet MBRS540, NRVBS540T3G (ON Semiconductor)
| 制造商 | ON Semiconductor |
| 描述 | Surface Mount Schottky Power Rectifier |
| 页数 / 页 | 7 / 1 — www.onsemi.com. SCHOTTKY BARRIER. RECTIFIER. 5.0 AMPERES, 40 VOLTS. … |
| 修订版 | 10 |
| 文件格式/大小 | PDF / 249 Kb |
| 文件语言 | 英语 |
www.onsemi.com. SCHOTTKY BARRIER. RECTIFIER. 5.0 AMPERES, 40 VOLTS. Features. SMC 2−LEAD. CASE 403AC. MARKING DIAGRAM
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文件文字版本
MBRS540T3G, NRVBS540T3G Surface Mount Schottky Power Rectifier The MBRS540T3 employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry
www.onsemi.com
features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in
SCHOTTKY BARRIER
surface mount applications where compact size and weight are critical
RECTIFIER
to the system.
5.0 AMPERES, 40 VOLTS Features
• Small Compact Surface Mountable Package with J−Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Excellent Ability to Withstand Reverse Avalanche Energy Transients
SMC 2−LEAD
•
CASE 403AC
Guard−Ring for Stress Protection • NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101
MARKING DIAGRAM
Qualified and PPAP Capable* • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant AYWW B540G G
Mechanical Characteristics
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 @ 0.125 in • Weight: 217 mg (Approximately) B540 = Specific Device Code • Finish: All External Surfaces Corrosion Resistant and Terminal A = Assembly Location** Leads are Readily Solderable Y = Year • WW = Work Week Lead and Mounting Surface Temperature for Soldering Purposes: G = Pb−Free Package 260°C Max. for 10 Seconds (Note: Microdot may be in either location) • Polarity: Polarity Band on Plastic Body Indicates Cathode Lead • ESD Rating: **The Assembly Location code (A) is front side option- al. In cases where the Assembly Location is stamped ♦ Machine Model, C (> 400 V) in the package, the front side assembly code may be ♦ Human Body Model, 3B (> 8000 V) blank. • Device Meets MSL 1 Requirements
ORDERING INFORMATION Device Package Shipping
† MBRS540T3G SMC 2,500 / (Pb−Free) Tape & Reel NRVBS540T3G* SMC 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
June, 2017 − Rev. 10 MBRS540T3/D
www.onsemi.com
features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in
SCHOTTKY BARRIER
surface mount applications where compact size and weight are critical
RECTIFIER
to the system.
5.0 AMPERES, 40 VOLTS Features
• Small Compact Surface Mountable Package with J−Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Excellent Ability to Withstand Reverse Avalanche Energy Transients
SMC 2−LEAD
•
CASE 403AC
Guard−Ring for Stress Protection • NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101
MARKING DIAGRAM
Qualified and PPAP Capable* • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant AYWW B540G G
Mechanical Characteristics
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 @ 0.125 in • Weight: 217 mg (Approximately) B540 = Specific Device Code • Finish: All External Surfaces Corrosion Resistant and Terminal A = Assembly Location** Leads are Readily Solderable Y = Year • WW = Work Week Lead and Mounting Surface Temperature for Soldering Purposes: G = Pb−Free Package 260°C Max. for 10 Seconds (Note: Microdot may be in either location) • Polarity: Polarity Band on Plastic Body Indicates Cathode Lead • ESD Rating: **The Assembly Location code (A) is front side option- al. In cases where the Assembly Location is stamped ♦ Machine Model, C (> 400 V) in the package, the front side assembly code may be ♦ Human Body Model, 3B (> 8000 V) blank. • Device Meets MSL 1 Requirements
ORDERING INFORMATION Device Package Shipping
† MBRS540T3G SMC 2,500 / (Pb−Free) Tape & Reel NRVBS540T3G* SMC 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
June, 2017 − Rev. 10 MBRS540T3/D