Datasheet TLP241B, TLP241BF (Toshiba) - 8

TLP241B,TLP241BF 16. Ordering Information (Example of Item Name) Item Name Packaging (Note 1) VDE Option Packing (MOQ) TLP241BF TH Magazine (100 pcs) TLP241B(LF1,F LF1 Magazine (100 pcs) TLP241B(LF5,F LF5 Magazine (100 pcs) TLP241B(TP1,F LF1 Tape and reel (1500 pcs) TLP241B(TP5,F LF5 Tape and reel (1500 pcs) TLP241B(D4,F TH EN 60747-5-5 Magazine (100 pcs) TLP241B(D4,LF1,F LF1 EN 60747-5-5 Magazine (100 pcs) TLP241B(D4,LF5,F LF5 EN 60747-5-5 Magazine (100 pcs) TLP241B(D4,TP1,F LF1 EN 60747-5-5 Tape and reel (1500 pcs) TLP241B(D4,TP5,F LF5 EN 60747-5-5 Tape and reel (1500 pcs) TLP241BF(F TH, Wide forming Magazine (100 pcs) TLP241BF(LF4,F LF4, Wide forming Magazine (100 pcs) TLP241BF(TP4,F LF4, Wide forming Tape and reel (1000 pcs) TLP241BF(D4,F TH, Wide forming EN 60747-5-5 Magazine (100 pcs) TLP241BF(D4LF4,F LF4, Wide forming EN 60747-5-5 Magazine (100 pcs) TLP241BF(D4TP4,F LF4, Wide forming EN 60747-5-5 Tape and reel (1000 pcs) Note 1: TH: Through-hole, LF: Lead forming for surface mount 17. Devices in Halogen-Free Resin Packages �This product is Halogen-Free Toshiba Electronic Devices & Storage Corporation ("Toshiba") defines a "Halogen-Free resin semiconductor product" as a semiconductor product in which: (1) the encapsulating resins do not contain any of the following elements: bromine (Br), chlorine (Cl) and antimony (Sb), respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the encapsulating resins, and/or (2) the resin portion(s) in printed circuit boards do not contain any of the following elements: bromine, chlorine and antimony, respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the each resin portion(s) in printed circuit boards. For avoidance of doubt, "Halogen-Free resin semiconductor product" does not mean, and Toshiba does not make any warranty of any kind, that said semiconductor product is entirely free of antimony or of any of the following elements of the halogen family: bromine, chlorine, iodine (I), fluorine (F) and astatine (At). In addition, a Halogen-Free resin semiconductor product may contain antimony and/or any of the elements of the halogen family as mentioned in the above paragraph in one or more portion(s) of the semiconductor product other than the encapsulating resins and the resin portion(s) in printed circuit boards. The information provided herein is accurate as of the date that it was provided, to the best of the knowledge and belief of the Toshiba Electronic Devices & Storage Corporation ("Toshiba"), Toshiba bases such knowledge and belief on information provided by third parties, and Toshiba makes no representation or warranty as to the accuracy of such third party information. Toshiba has taken and will continue to take, reasonable steps to provide accurate information to its customers, but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ©2020 8 2020-12-02 Toshiba Electronic Devices & Storage Corporation Rev.1.0