Datasheet LT8603 (Analog Devices) - 8

制造商Analog Devices
描述42V, Low IQ, Quad Output Triple Monolithic Buck Converter and Boost Controller
页数 / 页38 / 8 — TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = PVIN1 = PVIN2 = 12V, …
修订版B
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TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = PVIN1 = PVIN2 = 12V, EN/UVLO = 3V

TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = PVIN1 = PVIN2 = 12V, EN/UVLO = 3V

该数据表的模型线

文件文字版本

LT8603
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = PVIN1 = PVIN2 = 12V, EN/UVLO = 3V and PVIN3 = 3.3V unless otherwise noted. Feedback Voltage vs Temperature Switching Frequency vs RT Switching Frequency vs Temperature T
1.010 0.810 2.25 10 2.00 8 6 1.005 0.805 CH 3 AND CH 4 V 1.75 (V) 4 FB 1.50 2 1.000 0.800 1.25 0 FB –2 (V) 1.00 FREQUENCY (MHz) CH 1 AND CH 2 V –4 0.995 0.795 0.75 FREQUENCY CHANGE (%) –6 R CH 1 AND CH2 T = 30kΩ 0.50 R CH 3 AND CH4 –8 T = 60kΩ R 0.990 0.790 T = 250kΩ 0.25 –10 –50 –25 0 25 50 75 100 125 150 25 50 75 100 125 150 175 200 225 250 275 –50 –25 0 25 50 75 100 125 150 TEMPERATURE (°C) RT (kΩ) TEMPERATURE (°C) 8603 G19 8603 G20 8603 G21
POR Delay vs CPOR POR Delay Time vs Temperature POR
600 10 8 6 100 4 2 DELAY TIME CHANGE Y (ms) 0 –2 10 POR DELA Y TIME CHANGE (%) –4 DELA –6 –8 1 –10 100 1000 10000 –50 –25 0 25 50 75 100 125 150 CPOR (pF) TEMPERATURE (°C) 8603 G22 8603 G23
Channel 4 ILIM Threshold Channel 4 ILIM Threshold vs Common Mode vs Temperature
65 60.0 VBATT = 2V 63 58.0 VBATT = 42V 61 56.0 59 54.0 (mV) 57 (mV) 52.0 55 V ISN 50.0 V ISN 53 48.0 V ISP – V ISP – 51 46.0 49 44.0 47 42.0 45 40.0 0 5 10 15 20 25 30 35 40 45 –50 –25 0 25 50 75 100 125 150 VISP , VISN (V) TEMPERATURE (°C) 8603 G24 8603 G25 Rev. B 8 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information System Architecture Boost Controller Buck Regulators General Functions PCB Layout Thermal Considerations Typical Applications Package Description Revision History Related Parts