Datasheet ADA4856-3 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | Single-Supply, High Speed, Fixed G = +2, Rail-to-Rail Output Video Amplifier |
| 页数 / 页 | 20 / 5 — Data Sheet. ADA4856-3. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER … |
| 修订版 | B |
| 文件格式/大小 | PDF / 504 Kb |
| 文件语言 | 英语 |
Data Sheet. ADA4856-3. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER DISSIPATION. Table 3. Parameter. Rating. 3.0. 2.5. (W N. IO T. 2.0. ISSI D. 1.5
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Data Sheet ADA4856-3 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3. Parameter Rating
The maximum power that can be safely dissipated by the Supply Voltage 6 V ADA4856-3 is limited by the associated rise in junction Internal Power Dissipation1 See Figure 3 temperature. The maximum safe junction temperature for Common-Mode Input Voltage (−V plastic encapsulated devices is determined by the glass transition S − 0.2 V) to (+VS − 1 V) Differential Input Voltage ±V temperature of the plastic, approximately 150°C. Temporarily S Output Short-Circuit Duration Observe power curves exceeding this limit may cause a shift in parametric performance Storage Temperature Range −65°C to +125°C due to a change in the stresses exerted on the die by the package. Operating Temperature Range −40°C to +105°C Exceeding a junction temperature of 175°C for an extended Lead Temperature (Soldering, 10 sec) 300°C period can result in device failure. To ensure proper operation, it is necessary to observe the 1 Specification is for device in free air. maximum power derating curves. Stresses above those listed under Absolute Maximum Ratings
3.0
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
) 2.5
other conditions above those indicated in the operational
(W N
section of this specification is not implied. Exposure to absolute
IO T 2.0
maximum rating conditions for extended periods may affect
PA
device reliability.
ISSI D 1.5 ER THERMAL RESISTANCE W
θ
1.0 M PO
JA is specified for the worst-case conditions, that is, θJA is specified for a device soldered in a circuit board for surface-mount packages.
MU XI 0.5 MA Table 4.
103
Package Type θ 0
07686-
JA θJC Unit 0 10 20 30 40 50 60 70 80 90
16-Lead LFCSP 67 17.5 °C/W
–40 –30 –20 –10 100 AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. B | Page 5 of 20 Document Outline Features Applications Connection Diagram General Description Revision History Specifications 5 V Operation 3.3 V Operation Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Using the ADA4856-3 in Gains Equal to +1, −1 Unity-Gain Operation Option 1 Option 2 Inverting Unity-Gain Operation Using the ADA4856-3 in Gains Equal to +3, +4, and +5 Gain of +3 Configuration Gain of +4 Configuration Gain of +5 Configuration 20 MHz Active Low-Pass Filter Video Line Driver Single-Supply Operation Power Down Layout Considerations Power Supply Bypassing Outline Dimensions Ordering Guide
Data Sheet ADA4856-3 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3. Parameter Rating
The maximum power that can be safely dissipated by the Supply Voltage 6 V ADA4856-3 is limited by the associated rise in junction Internal Power Dissipation1 See Figure 3 temperature. The maximum safe junction temperature for Common-Mode Input Voltage (−V plastic encapsulated devices is determined by the glass transition S − 0.2 V) to (+VS − 1 V) Differential Input Voltage ±V temperature of the plastic, approximately 150°C. Temporarily S Output Short-Circuit Duration Observe power curves exceeding this limit may cause a shift in parametric performance Storage Temperature Range −65°C to +125°C due to a change in the stresses exerted on the die by the package. Operating Temperature Range −40°C to +105°C Exceeding a junction temperature of 175°C for an extended Lead Temperature (Soldering, 10 sec) 300°C period can result in device failure. To ensure proper operation, it is necessary to observe the 1 Specification is for device in free air. maximum power derating curves. Stresses above those listed under Absolute Maximum Ratings
3.0
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
) 2.5
other conditions above those indicated in the operational
(W N
section of this specification is not implied. Exposure to absolute
IO T 2.0
maximum rating conditions for extended periods may affect
PA
device reliability.
ISSI D 1.5 ER THERMAL RESISTANCE W
θ
1.0 M PO
JA is specified for the worst-case conditions, that is, θJA is specified for a device soldered in a circuit board for surface-mount packages.
MU XI 0.5 MA Table 4.
103
Package Type θ 0
07686-
JA θJC Unit 0 10 20 30 40 50 60 70 80 90
16-Lead LFCSP 67 17.5 °C/W
–40 –30 –20 –10 100 AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. B | Page 5 of 20 Document Outline Features Applications Connection Diagram General Description Revision History Specifications 5 V Operation 3.3 V Operation Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Using the ADA4856-3 in Gains Equal to +1, −1 Unity-Gain Operation Option 1 Option 2 Inverting Unity-Gain Operation Using the ADA4856-3 in Gains Equal to +3, +4, and +5 Gain of +3 Configuration Gain of +4 Configuration Gain of +5 Configuration 20 MHz Active Low-Pass Filter Video Line Driver Single-Supply Operation Power Down Layout Considerations Power Supply Bypassing Outline Dimensions Ordering Guide