Datasheet ADL5321 (Analog Devices) - 5

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Data Sheet ADL5321 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
Table 4 lists the junction-to-air thermal resistance (θJA) and the Supply Voltage, VCC 6.5 V junction-to-paddle thermal resistance (θJC) for the ADL5321. Input Power, 50 Ω Impedance 20 dBm
Table 4. Thermal Resistance
Internal Power Dissipation, Paddle Soldered 683 mW
Package Type θ 1 2 JA θJC Unit
θJC, Junction to Paddle 28.5°C/W 3-Lead SOT-89 35 11 °C/W Maximum Junction Temperature 150°C 1 Measured on Analog Devices evaluation board. For more information about Operating Temperature Range −40°C to +105°C board layout, see the Soldering Information and Recommended PCB Land Storage Temperature Range −65°C to +150°C Pattern section. 2 Based on simulation with JEDEC standard JESD51. Stresses above those listed under Absolute Maximum Ratings
ESD CAUTION
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. D | Page 5 of 16 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure WiMax Operation Evaluation Board Outline Dimensions Ordering Guide