Datasheet HMC634 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | GaAs PHEMT MMIC DRIVER AMPLIFIER, 5 -20 GHz |
| 页数 / 页 | 8 / 5 — HMC634. GaAs PHEMT MMIC DRIVER. AMPLIFIER, 5 - 20 GHz. Outline Drawing. … |
| 文件格式/大小 | PDF / 410 Kb |
| 文件语言 | 英语 |
HMC634. GaAs PHEMT MMIC DRIVER. AMPLIFIER, 5 - 20 GHz. Outline Drawing. Die Packaging Information. 2 - 54
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文件文字版本
HMC634
v01.0308
GaAs PHEMT MMIC DRIVER AMPLIFIER, 5 - 20 GHz Outline Drawing
2 IP H - C S R IE IF L P M K A OC BL IN A NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” & G 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD R 5. BOND PAD METALLIZATION: GOLD E 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. IV R D
Die Packaging Information
[1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. Information furnis F he o d r pri by An ce, de alog Devic leiv s ies ry be , a lievend to pla d to be accurce o ate an rd der relia s bl , pl e. Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
2 - 54
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Pho - n 25 e: 7 0- 81 33 2 4 9- 3 F 470 ax: 978 0 • Order o - n25 lin 0- e a 3 t 373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hit A tpite.co plicatio m n Support: Phone: 1-800-ANALOG-D
v01.0308
GaAs PHEMT MMIC DRIVER AMPLIFIER, 5 - 20 GHz Outline Drawing
2 IP H - C S R IE IF L P M K A OC BL IN A NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” & G 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD R 5. BOND PAD METALLIZATION: GOLD E 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. IV R D
Die Packaging Information
[1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. Information furnis F he o d r pri by An ce, de alog Devic leiv s ies ry be , a lievend to pla d to be accurce o ate an rd der relia s bl , pl e. Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
2 - 54
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Pho - n 25 e: 7 0- 81 33 2 4 9- 3 F 470 ax: 978 0 • Order o - n25 lin 0- e a 3 t 373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hit A tpite.co plicatio m n Support: Phone: 1-800-ANALOG-D