Datasheet HMC407MS8G, 407MS8GE (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | GaAs InGaP HBT MMIC POWER AMPLIFIER, 5 - 7 GHz |
| 页数 / 页 | 6 / 4 — HMC407MS8G / 407MS8GE. GaAs InGaP HBT MMIC. POWER AMPLIFIER, 5 - 7 GHz |
| 文件格式/大小 | PDF / 921 Kb |
| 文件语言 | 英语 |
HMC407MS8G / 407MS8GE. GaAs InGaP HBT MMIC. POWER AMPLIFIER, 5 - 7 GHz
该数据表的模型线
文件文字版本
HMC407MS8G / 407MS8GE
v04.1019
GaAs InGaP HBT MMIC POWER AMPLIFIER, 5 - 7 GHz Gain, Power & Quiescent Supply Current vs. Vpd @ 5.8 GHz Absolute Maximum Ratings
30 250 Collector Bias Voltage (Vcc1, Vcc2) +5.5 Vdc Control Voltage (Vpd) +5.5 Vdc 25 200 RF Input Power (RFIN)(Vs = Vpd = +5Vdc) +20 dBm P1dB Junction Temperature 150 °C 20 Psat 150 Ic Bm), Psat (dBm) Gain q (m Continuous Pdiss (T = 85 °C) 2 W (derate 31 mW/°C above 85 °C) A) 15 Icq 100 Thermal Resistance 32 °C/W (junction to ground paddle) 9 (dB), P1dB (d 10 50 Storage Temperature -65 to +150 °C GAIN Operating Temperature -40 to +85 °C 5 0 T 2.5 3 3.5 4 4.5 5 Vpd (Vdc) M ELECTROSTATIC SENSITIVE DEVICE OBSERVE
8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP]
HANDLING PRECAUTIONS
(RH-8-1) Outline Drawing Dimensions shown in millimeters
R - S E
3.10 2.26
W
3.00 2.90 2.16
O
2.06 8 5 3.10 5.05 1.83 3.00 4.90 EXPOSED PAD 1.73 2.90 4.75 1.63 1 4
R & P A
TOP VIEW BOTTOM VIEW 0.65
E
BSC 1.95 BSC 0.94 0.86 1.10 0.25 GAGE SIDE VIEW END VIEW
IN
MAX PLANE 0.23 0.78 0.08 0.13 0.40 6° MAX 0.33 0.70 0° 0.95 COPLANARITY 0.25 0.55 REF
S - L
0.10 0.40
R
PKG-003371 COMPLIANT TO JEDEC STANDARDS MO-187-AA-T 08-02-2019-B
IE 8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] (RH-8-1) LIF Dimensions shown in millimeters P
Package Information
M Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] A HMC407MS8G Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H407 XXXX HMC407MS8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H407 XXXX HMC407MS8GETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H407 XXXX HMC407MS8GTR Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H407 XXXX 104987- Eval Board HMC407MS8G [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
9 - 4
Application Support: Phone: 1-800-ANALOG-D
v04.1019
GaAs InGaP HBT MMIC POWER AMPLIFIER, 5 - 7 GHz Gain, Power & Quiescent Supply Current vs. Vpd @ 5.8 GHz Absolute Maximum Ratings
30 250 Collector Bias Voltage (Vcc1, Vcc2) +5.5 Vdc Control Voltage (Vpd) +5.5 Vdc 25 200 RF Input Power (RFIN)(Vs = Vpd = +5Vdc) +20 dBm P1dB Junction Temperature 150 °C 20 Psat 150 Ic Bm), Psat (dBm) Gain q (m Continuous Pdiss (T = 85 °C) 2 W (derate 31 mW/°C above 85 °C) A) 15 Icq 100 Thermal Resistance 32 °C/W (junction to ground paddle) 9 (dB), P1dB (d 10 50 Storage Temperature -65 to +150 °C GAIN Operating Temperature -40 to +85 °C 5 0 T 2.5 3 3.5 4 4.5 5 Vpd (Vdc) M ELECTROSTATIC SENSITIVE DEVICE OBSERVE
8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP]
HANDLING PRECAUTIONS
(RH-8-1) Outline Drawing Dimensions shown in millimeters
R - S E
3.10 2.26
W
3.00 2.90 2.16
O
2.06 8 5 3.10 5.05 1.83 3.00 4.90 EXPOSED PAD 1.73 2.90 4.75 1.63 1 4
R & P A
TOP VIEW BOTTOM VIEW 0.65
E
BSC 1.95 BSC 0.94 0.86 1.10 0.25 GAGE SIDE VIEW END VIEW
IN
MAX PLANE 0.23 0.78 0.08 0.13 0.40 6° MAX 0.33 0.70 0° 0.95 COPLANARITY 0.25 0.55 REF
S - L
0.10 0.40
R
PKG-003371 COMPLIANT TO JEDEC STANDARDS MO-187-AA-T 08-02-2019-B
IE 8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] (RH-8-1) LIF Dimensions shown in millimeters P
Package Information
M Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] A HMC407MS8G Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H407 XXXX HMC407MS8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H407 XXXX HMC407MS8GETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H407 XXXX HMC407MS8GTR Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H407 XXXX 104987- Eval Board HMC407MS8G [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
9 - 4
Application Support: Phone: 1-800-ANALOG-D