Datasheet HMC326MS8G, 326MS8GE (Analog Devices) - 4

HMC326MS8G / 326MS8GE
v11.1019
GaAs InGaP HBT MMIC DRIVER AMPLIFIER, 3.0 - 4.5 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +5.5 Vdc Control Voltage Range (Vpd) +5.5 Vdc ELECTROSTATIC SENSITIVE DEVICE T RF Input Power (RFIN)(Vs = Vpd = +5Vdc) +15 dBm OBSERVE HANDLING PRECAUTIONS M Junction Temperature 150 °C Continuous Pdiss (T = 85 °C) 0.916 W (derate 14 mW/°C above 85 °C) Thermal Resistance K - S 71 °C/W (junction to ground paddle) C Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C LO
8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP]
ESD Sensitivity (HBM) Class 1A
(RH-8-1) Dimensions shown in millimeters Outline Drawing
IN B A
3.10 3.00 2.26 2.90 2.16 2.06 8 5 5.05
R & G
3.10 1.83 3.00 4.90 EXPOSED PAD 1.73
E
2.90 4.75 1.63 1 4
IV R
TOP VIEW BOTTOM VIEW 0.65 BSC 1.95 BSC 0.94 0.86 1.10 0.25 GAGE SIDE VIEW END VIEW MAX PLANE 0.23 0.78 0.08
S - D
0.13 0.40 6°
R
MAX 0.33 0.70 0° 0.95 COPLANARITY 0.25 0.55 REF
IE
0.10 0.40
LIF
PKG-003371 COMPLIANT TO JEDEC STANDARDS MO-187-AA-T 08-02-2019-B
P 8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] M (RH-8-1) A Dimensions shown in mil imeters.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC326MS8G Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H326 XXXX HMC326MS8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H326 XXXX HMC326MS8GETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H326 XXXX HMC326MS8GTR Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H326 XXXX 104356 - Evaluation Board HMC326MS8G [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performanc Characteristics Broadband Gain & Return Loss Gain vs. Temperature P1dB vs. Temperature Psat vs. Temperature Output IP3 vs. Temperature Power Compression @ 3.5 GHz Input Return Loss vs. Temperature Output Return Loss vs. Temperature Reverse Isolation vs. Temperature Noise Figure vs. Temperature Gain, Power & Quiescent Supply Current vs. Vpd @3.5 GHz Absolute Maximum Ratings Outline Drawing Package Information Evaluation PCB List of Materials for Evaluation PCB 104356 Application Circuit