Datasheet HMC326MS8G, 326MS8GE (Analog Devices) - 5

HMC326MS8G / 326MS8GE
v11.1019
GaAs InGaP HBT MMIC DRIVER AMPLIFIER, 3.0 - 4.5 GHz Evaluation PCB
T M K - S C LO IN B A R & G E IV R S - D R IE LIF P M A
List of Materials for Evaluation PCB 104356 [1]
The circuit board used in the final application Item Description should use RF circuit design techniques. Signal J1 - J2 PCB Mount SMA RF Connector lines should have 50 Ohm impedance while the J3 2mm DC Header package ground leads and exposed paddle should C1 - C2 330 pF Capacitor, 0603 Pkg. be connected directly to the ground plane similar to C3 0.7 pF Capacitor, 0603 Pkg. that shown. A sufficient number of via holes should C4 3.0 pF Capacitor, 0402 Pkg. be used to connect the top and bottom ground C5 2.2 µF Capacitor, Tantalum planes. The evaluation board should be mounted L1 3.3 nH Inductor, 0805 Pkg. to an appropriate heat sink. The evaluation circuit HMC326MS8G / HMC326MS8GE U1 board shown is available from Analog Devices Amplifier upon request. PCB [2] 104106 Eval Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350, 10 mil thick, tr = 3.48 For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performanc Characteristics Broadband Gain & Return Loss Gain vs. Temperature P1dB vs. Temperature Psat vs. Temperature Output IP3 vs. Temperature Power Compression @ 3.5 GHz Input Return Loss vs. Temperature Output Return Loss vs. Temperature Reverse Isolation vs. Temperature Noise Figure vs. Temperature Gain, Power & Quiescent Supply Current vs. Vpd @3.5 GHz Absolute Maximum Ratings Outline Drawing Package Information Evaluation PCB List of Materials for Evaluation PCB 104356 Application Circuit