Datasheet HMC311LP3, 311LP3E (Analog Devices) - 5

HMC311LP3 / 311LP3E
v07.0420
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +7V T RF Input Power (RFIN)(Vs = +5V) +10 dBm ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS M Junction Temperature 150 °C Continuous Pdiss (T = 85 °C) 0.339 W (derate 5.21 mW/°C above 85 °C) Thermal Resistance S - S 192 °C/W (junction to ground paddle) R Storage Temperature -65 to +150 °C IE Operating Temperature -40 to +85 °C Class 1A, ESD Sensitivity (HBM) LIF Passed 250V P
16-Lead Lead Frame Chip Scale Package [LFCSP 3 x 3 mm Body and 0.85 mm Package Height
M
Outline Drawing (CP-16-50) Dimensions shown in millimeters
K A
DETAIL A
C
3.10 (JEDEC 95) 0.30 3.00 SQ 0.25 PIN 1 INDICATOR 2.90
LO
0.20 AREA PIN 1 INDICATOR AREA OPTIONS 0.50 13 16 (SEE DETAIL A) 12 1 BSC 1.70
IN B
EXPOSED 1.60 SQ PAD
A
1.50 9 4 8 5 0.45 0.20 MIN TOP VIEW BOTTOM VIEW 0.40 0.35
R & G
0.90 FOR PROPER CONNECTION OF 0.85 THE EXPOSED PAD, REFER TO
E
0.05 MAX 0.80 0.02 NOM THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS COPLANARITY
IV
SECTION OF THIS DATA SHEET. SEATING 0.08 PLANE
R
0.203 REF
D
PKG-004831 COMPLIANT TO JEDEC STANDARDS MO-220-VEED-4 08-30-2018-A
16-Lead Lead Frame Chip Scale Package [LFCSP 3 mm x 3 mm Body and 0.85 mm Package Height (CP-16-50) Dimensions shown in mil imeters
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC311LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] 311 XXXX HMC311LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 311 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D