Datasheet ADL9006CHIPS (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 2 GHz to 28 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier |
| 页数 / 页 | 16 / 7 — Data Sheet. ADL9006CHIPS. TYPICAL PERFORMANCE CHARACTERISTICS SMALL … |
| 文件格式/大小 | PDF / 547 Kb |
| 文件语言 | 英语 |
Data Sheet. ADL9006CHIPS. TYPICAL PERFORMANCE CHARACTERISTICS SMALL SIGNAL RESPONSE. +85°C. +25°C. –55°C. ) B. (d S S. O L. S11. S21. URN. (dB
该数据表的模型线
文件文字版本
Data Sheet ADL9006CHIPS TYPICAL PERFORMANCE CHARACTERISTICS SMALL SIGNAL RESPONSE 20 20 +85°C 15 +25°C 18 –55°C ) B 10 16 (d S S 5 O L 14 S11 ) 0 S21 URN (dB T S22 12 IN –5 RE GA 10 –10 AND IN A 8 G –15 –20 6 –25
8
4 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
00
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
-011 2- 22
FREQUENCY (GHz)
1 2012
FREQUENCY (GHz)
20 Figure 8. Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures
18 20 17 15 16 10 15 5 14 0 ) 13 ) B d –5 (dB 12 ( IN IN –10 GA 11 GA –15 10 9 –20 8 4V –25 5V –0.4V +0.8V +2.0V 7 6V –30 –2.0V –1.2V 0V +1.2V +2.4V 7V –1.6V –0.8V +0.4V +1.6V +2.6V 6
9
–35
2
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
00
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
2- 01 2-
FREQUENCY (GHz)
2012
FREQUENCY (GHz)
2012 Figure 9. Gain vs. Frequency at Various Supply Voltages Figure 12. Gain vs. Frequency at Various VGG2 Voltages
20 0 15 +85°C +25°C –55°C 10 –10 ) 5 B (d 0 N ) IO –20 T –5 A (dB L IN O –10 IS GA SE –30 –15 2GHz 6GHz –20 10GHz EVER 14GHz R –25 16GHz –40 20GHz –30 24GHz 28GHz –35 –50
3
–2.0 –1.6 –1.2 –0.8 –0.4 0 0.4 0.8 1.2 1.6 2.0 2.4
10 01 -0
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
2-
V
122
GG2 (V) FREQUENCY (GHz)
20 2012 Figure 10. Gain vs. V Figure 13. Reverse Isolation vs. Frequency at Various Temperatures GG2 for Various Frequencies Rev. 0 | Page 7 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 2 GHz TO 14 GHz 14 GHz TO 22 GHz 22 GHz TO 28 GHz DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ELECTRONIC DISCHARGE (ESD) RATINGS ESD Ratings for ADL9006CHIPS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS SMALL SIGNAL RESPONSE LARGE SIGNAL RESPONSE THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
8
4 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
00
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
-011 2- 22
FREQUENCY (GHz)
1 2012
FREQUENCY (GHz)
20 Figure 8. Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures
18 20 17 15 16 10 15 5 14 0 ) 13 ) B d –5 (dB 12 ( IN IN –10 GA 11 GA –15 10 9 –20 8 4V –25 5V –0.4V +0.8V +2.0V 7 6V –30 –2.0V –1.2V 0V +1.2V +2.4V 7V –1.6V –0.8V +0.4V +1.6V +2.6V 6
9
–35
2
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
00
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
2- 01 2-
FREQUENCY (GHz)
2012
FREQUENCY (GHz)
2012 Figure 9. Gain vs. Frequency at Various Supply Voltages Figure 12. Gain vs. Frequency at Various VGG2 Voltages
20 0 15 +85°C +25°C –55°C 10 –10 ) 5 B (d 0 N ) IO –20 T –5 A (dB L IN O –10 IS GA SE –30 –15 2GHz 6GHz –20 10GHz EVER 14GHz R –25 16GHz –40 20GHz –30 24GHz 28GHz –35 –50
3
–2.0 –1.6 –1.2 –0.8 –0.4 0 0.4 0.8 1.2 1.6 2.0 2.4
10 01 -0
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
2-
V
122
GG2 (V) FREQUENCY (GHz)
20 2012 Figure 10. Gain vs. V Figure 13. Reverse Isolation vs. Frequency at Various Temperatures GG2 for Various Frequencies Rev. 0 | Page 7 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 2 GHz TO 14 GHz 14 GHz TO 22 GHz 22 GHz TO 28 GHz DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ELECTRONIC DISCHARGE (ESD) RATINGS ESD Ratings for ADL9006CHIPS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS SMALL SIGNAL RESPONSE LARGE SIGNAL RESPONSE THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE