Datasheet HMC392ALC4 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | GaAs MMIC Low Noise Amplifier, 3.5 - 8.0 GHz |
| 页数 / 页 | 11 / 7 — HMC392ALC4. GaAs MMIC LOW NOISE. AMPLIFIER, 3.5 - 8.0 GHz. Outline Drawing |
| 文件格式/大小 | PDF / 916 Kb |
| 文件语言 | 英语 |
HMC392ALC4. GaAs MMIC LOW NOISE. AMPLIFIER, 3.5 - 8.0 GHz. Outline Drawing
该数据表的模型线
文件文字版本
HMC392ALC4
v01.0117
GaAs MMIC LOW NOISE AMPLIFIER, 3.5 - 8.0 GHz Outline Drawing
T
24-Terminal Ceramic Leadless Chip Carrier with [LCC]
M
(E-24-1) Dimensions shown in millimeters.
E - S IS
4.13 0.36
O
4.00 SQ 0.30 PIN 1 3.87 0.24 PIN 1 (0.32 × 0.32) INDICATOR 19
W N
24 18 1
O
0.50 BSC EXPOSED 2.50 SQ PAD
S - L R
13 6
IE
12 7 TOP VIEW BOTTOM VIEW 2.50 REF
LIF
1.02 MAX SIDE VIEW 3.10 BSC
P M A
SEATING PLANE
NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA.
PKG-000000
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL
04-03-2015-A
3. DIMENSIONS ARE IN INCHES (MILLIMETERS). 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, BLACK INK, OR LASER MARK LOCATED APPROX. AS SHOWN. 6. PACKAGE WARP SHALL NOT EXCEED 0.05MM DATUM – C – 7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Pin Number Package Body Material Lead Finish MSL Rating Package Marking[2] H392A HMC392ALC4 Alumina, White Gold over Nickel MSL 3[1] XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
v01.0117
GaAs MMIC LOW NOISE AMPLIFIER, 3.5 - 8.0 GHz Outline Drawing
T
24-Terminal Ceramic Leadless Chip Carrier with [LCC]
M
(E-24-1) Dimensions shown in millimeters.
E - S IS
4.13 0.36
O
4.00 SQ 0.30 PIN 1 3.87 0.24 PIN 1 (0.32 × 0.32) INDICATOR 19
W N
24 18 1
O
0.50 BSC EXPOSED 2.50 SQ PAD
S - L R
13 6
IE
12 7 TOP VIEW BOTTOM VIEW 2.50 REF
LIF
1.02 MAX SIDE VIEW 3.10 BSC
P M A
SEATING PLANE
NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA.
PKG-000000
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL
04-03-2015-A
3. DIMENSIONS ARE IN INCHES (MILLIMETERS). 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, BLACK INK, OR LASER MARK LOCATED APPROX. AS SHOWN. 6. PACKAGE WARP SHALL NOT EXCEED 0.05MM DATUM – C – 7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Pin Number Package Body Material Lead Finish MSL Rating Package Marking[2] H392A HMC392ALC4 Alumina, White Gold over Nickel MSL 3[1] XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D