link to page 6 link to page 6 link to page 6 link to page 6 link to page 6 HMC8410Data SheetPIN CONFIGURATION AND FUNCTION DESCRIPTIONSGND 16NICHMC8410RFIN/V25GG1RFOUT/VDDTOP VIEW(Not to Scale)34NICNICNOTES 1. NIC = NOT INTERNALLY CONNECTED. THIS PIN MUST BE CONNECTED TO THE RF/DC GROUND. 002 2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND. 14657- Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No.MnemonicDescription 1 GND Ground. This pin must be connected to the RF/dc ground. See Figure 3 for the interface schematic. 2 RFIN/VGG1 RF Input (RFIN). This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the interface schematic. Gate Bias of the Amplifier (VGG1). This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the interface schematic. 3, 4, 6 NIC Not Internally Connected. This pin must be connected to the RF/dc ground. 5 RFOUT/VDD RF Output (RFOUT). This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface schematic. Drain Bias for Amplifier (VDD). This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface schematic. EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground. INTERFACE SCHEMATICSRFOUT/VDDGND 003 005 14657- 14657- Figure 3. GND Interface Schematic Figure 5. RFOUT/VDD Interface Schematic RFIN/VGG1 004 14657- Figure 4. RFIN/VGG1 Interface Schematic Rev. D | Page 6 of 17 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY ELECTRICAL SPECIFICATIONS 0.01 GHz TO 3 GHz FREQUENCY RANGE 3 GHz TO 8 GHz FREQUENCY RANGE 8 GHz TO 10 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING During Power-Up During Power-Down TYPICAL APPLICATION CIRCUIT EVALUATION BOARD EVALUATION BOARD SCHEMATIC OUTLINE DIMENSIONS ORDERING GUIDE