Datasheet HMC8410CHIPS (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | 0.01 GHz to 10 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier |
| 页数 / 页 | 17 / 5 — Data Sheet. HMC8410CHIPS. ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL … |
| 修订版 | C |
| 文件格式/大小 | PDF / 427 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC8410CHIPS. ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE. Parameter1. Rating. Table 5. Thermal Resistance
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Data Sheet HMC8410CHIPS ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter1 Rating
θJC is the junction to case thermal resistance, and channel to Drain Bias Voltage (VDD) 7 V dc bottom of die. Radio Frequency (RF) Input Power (RFIN) 20 dBm Continuous Power Dissipation (P
Table 5. Thermal Resistance
DISS), T = 85°C 0.72 W (Derate 8.0 mW/°C Above 85°C)
Package Type θJC Unit
Channel Temperature 175°C C-2-3 125.85 °C/W Storage Temperature Range −65°C to +150°C Operating Temperature Range −55°C to +85°C
ESD CAUTION
ESD Sensitivity Human Body Model (HBM) Class 1B passed 500 V 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the specification is listed. For the full pin names of multifunction pins, refer to the Pin Configuration and Function Descriptions section. 2 See the Ordering Guide section for more information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 5 of 17 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 0.01 GHz TO 3 GHz FREQUENCY RANGE 3 GHz TO 8 GHz FREQUENCY RANGE 8 GHz TO 10 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet HMC8410CHIPS ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter1 Rating
θJC is the junction to case thermal resistance, and channel to Drain Bias Voltage (VDD) 7 V dc bottom of die. Radio Frequency (RF) Input Power (RFIN) 20 dBm Continuous Power Dissipation (P
Table 5. Thermal Resistance
DISS), T = 85°C 0.72 W (Derate 8.0 mW/°C Above 85°C)
Package Type θJC Unit
Channel Temperature 175°C C-2-3 125.85 °C/W Storage Temperature Range −65°C to +150°C Operating Temperature Range −55°C to +85°C
ESD CAUTION
ESD Sensitivity Human Body Model (HBM) Class 1B passed 500 V 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the specification is listed. For the full pin names of multifunction pins, refer to the Pin Configuration and Function Descriptions section. 2 See the Ordering Guide section for more information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 5 of 17 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 0.01 GHz TO 3 GHz FREQUENCY RANGE 3 GHz TO 8 GHz FREQUENCY RANGE 8 GHz TO 10 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE