Datasheet HMC8410CHIPS (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 0.01 GHz to 10 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier |
| 页数 / 页 | 17 / 8 — HMC8410CHIPS. Data Sheet. +85°C. +85°C +25°C. +25°C. –55°C. Bm). 2 (. B … |
| 修订版 | C |
| 文件格式/大小 | PDF / 427 Kb |
| 文件语言 | 英语 |
HMC8410CHIPS. Data Sheet. +85°C. +85°C +25°C. +25°C. –55°C. Bm). 2 (. B (. UT O. FREQUENCY (GHz). +25°C –55°C. ) B. –10. (d N. IO T. –15. AT S. –20. SE I. EVER
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HMC8410CHIPS Data Sheet 25 50 +85°C +85°C +25°C 24 +25°C 45 –55°C –55°C 23 40 22 35 Bm) 21 d 30 Bm) 2 ( d P 20 I 25 B ( UT 1d P P 19 20 UT O 18 15 17 10 16 5 15 0
015
0 1 2 3 4 5 6 7 8 9 10 11
012
0 1 2 3 4 5 6 7 8 9 10 11 FREQUENCY (GHz) FREQUENCY (GHz)
15093- 15093- Figure 12. P1dB vs. Frequency for Various Temperatures Figure 15. Output IP2 vs. Frequency for Various Temperatures at POUT/Tone = 5 dBm
25 0 +85°C 24 +25°C –55°C –5 23 ) B 22 –10 (d N 21 IO T –15 Bm) A d L ( 20 SO AT S –20 P 19 SE I 18 EVER –25 R 17 +85°C –30 16 +25°C –55°C 15 –35 0 1 2 3 4 5 6 7 8 9 10 11
013
0 1 2 3 4 5 6 7 8 9 10 11
016
FREQUENCY (GHz) FREQUENCY (GHz)
15093- 15093- Figure 13. PSAT vs. Frequency for Various Temperatures Figure 16. Reverse Isolation vs. Frequency for Various Temperatures
40 40 35 35 30 30 Bm) 25 Bm) 25 d d 3 ( 3 ( P P I 20 I 20 UT UT P P 15 15 UT UT O O 10 10 5 +85°C 5 + 0d 85° Bm C +25°C + 5d 25° Bm C –55°C –55° 10d C Bm 0 0 0 1 2 3 4 5 6 7 8 9 10 11
014
0 1 2 3 4 5 6 7 8 9 10 11
017
FREQUENCY (GHz) FREQUENCY (GHz)
15093- 15093- Figure 14. Output IP3 vs. Frequency for Various Temperatures, Figure 17. Output IP3 vs. Frequency for Various POUT/Tone Output Power (POUT)/Tone = 5 dBm Rev. C | Page 8 of 17 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 0.01 GHz TO 3 GHz FREQUENCY RANGE 3 GHz TO 8 GHz FREQUENCY RANGE 8 GHz TO 10 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
015
0 1 2 3 4 5 6 7 8 9 10 11
012
0 1 2 3 4 5 6 7 8 9 10 11 FREQUENCY (GHz) FREQUENCY (GHz)
15093- 15093- Figure 12. P1dB vs. Frequency for Various Temperatures Figure 15. Output IP2 vs. Frequency for Various Temperatures at POUT/Tone = 5 dBm
25 0 +85°C 24 +25°C –55°C –5 23 ) B 22 –10 (d N 21 IO T –15 Bm) A d L ( 20 SO AT S –20 P 19 SE I 18 EVER –25 R 17 +85°C –30 16 +25°C –55°C 15 –35 0 1 2 3 4 5 6 7 8 9 10 11
013
0 1 2 3 4 5 6 7 8 9 10 11
016
FREQUENCY (GHz) FREQUENCY (GHz)
15093- 15093- Figure 13. PSAT vs. Frequency for Various Temperatures Figure 16. Reverse Isolation vs. Frequency for Various Temperatures
40 40 35 35 30 30 Bm) 25 Bm) 25 d d 3 ( 3 ( P P I 20 I 20 UT UT P P 15 15 UT UT O O 10 10 5 +85°C 5 + 0d 85° Bm C +25°C + 5d 25° Bm C –55°C –55° 10d C Bm 0 0 0 1 2 3 4 5 6 7 8 9 10 11
014
0 1 2 3 4 5 6 7 8 9 10 11
017
FREQUENCY (GHz) FREQUENCY (GHz)
15093- 15093- Figure 14. Output IP3 vs. Frequency for Various Temperatures, Figure 17. Output IP3 vs. Frequency for Various POUT/Tone Output Power (POUT)/Tone = 5 dBm Rev. C | Page 8 of 17 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 0.01 GHz TO 3 GHz FREQUENCY RANGE 3 GHz TO 8 GHz FREQUENCY RANGE 8 GHz TO 10 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE