Datasheet HMC8402 (Analog Devices) - 3
| 制造商 | Analog Devices |
| 描述 | 2 GHz to 30 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier |
| 页数 / 页 | 15 / 3 — Data Sheet. HMC8402. SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE. … |
| 修订版 | E |
| 文件格式/大小 | PDF / 380 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC8402. SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE. Table 1. Parameter. Symbol. Test Conditions/Comments. Min. Typ
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Data Sheet HMC8402 SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE
TA = 25°C, VDD = 7 V, IDQ = 74 mA.
Table 1. Parameter Symbol Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE 2 18 GHz GAIN 11.5 13.5 dB Gain Variation Over Temperature 0.005 dB/°C RETURN LOSS Input 10 dB Output 12 dB OUTPUT Output Power for 1 dB Compression P1dB 19 21 dBm Saturated Output Power PSAT 22 dBm Output Third Order Intercept IP3 Measurement taken at POUT/tone = 0 dBm 26 dBm NOISE FIGURE NF 2.5 5 dB SUPPLY CURRENT Total Supply Current IDQ Nominal voltage (VDD) = 7 V 45 68 85 mA Total Supply Current vs. VDD IDQ VDD = 5 V 62 mA VDD = 6 V 65 mA VDD = 7 V 68 mA VDD = 8 V 72 mA SUPPLY VOLTAGE VDD 5 7 8 V
18 GHz TO 26 GHz FREQUENCY RANGE
TA = 25°C, VDD = 7 V, IDQ = 74 mA.
Table 2. Parameter Symbol Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE 18 26 GHz GAIN 11.5 13.5 dB Gain Variation Over Temperature 0.006 dB/°C RETURN LOSS Input 17 dB Output 14 dB OUTPUT Output Power for 1 dB Compression P1dB 17 20 dBm Saturated Output Power PSAT 21 dBm Output Third Order Intercept IP3 Measurement taken at POUT/tone = 0 dBm 24 dBm NOISE FIGURE NF 2.5 4 dB SUPPLY CURRENT Total Supply Current IDQ Nominal voltage (VDD) = 7 V 45 68 85 mA Total Supply Current vs. VDD IDQ VDD = 5 V 62 mA VDD = 6 V 65 mA VDD = 7 V 68 mA VDD = 8 V 72 mA SUPPLY VOLTAGE VDD 5 7 8 V Rev. E | Page 3 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, VDD = 7 V, IDQ = 74 mA.
Table 1. Parameter Symbol Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE 2 18 GHz GAIN 11.5 13.5 dB Gain Variation Over Temperature 0.005 dB/°C RETURN LOSS Input 10 dB Output 12 dB OUTPUT Output Power for 1 dB Compression P1dB 19 21 dBm Saturated Output Power PSAT 22 dBm Output Third Order Intercept IP3 Measurement taken at POUT/tone = 0 dBm 26 dBm NOISE FIGURE NF 2.5 5 dB SUPPLY CURRENT Total Supply Current IDQ Nominal voltage (VDD) = 7 V 45 68 85 mA Total Supply Current vs. VDD IDQ VDD = 5 V 62 mA VDD = 6 V 65 mA VDD = 7 V 68 mA VDD = 8 V 72 mA SUPPLY VOLTAGE VDD 5 7 8 V
18 GHz TO 26 GHz FREQUENCY RANGE
TA = 25°C, VDD = 7 V, IDQ = 74 mA.
Table 2. Parameter Symbol Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE 18 26 GHz GAIN 11.5 13.5 dB Gain Variation Over Temperature 0.006 dB/°C RETURN LOSS Input 17 dB Output 14 dB OUTPUT Output Power for 1 dB Compression P1dB 17 20 dBm Saturated Output Power PSAT 21 dBm Output Third Order Intercept IP3 Measurement taken at POUT/tone = 0 dBm 24 dBm NOISE FIGURE NF 2.5 4 dB SUPPLY CURRENT Total Supply Current IDQ Nominal voltage (VDD) = 7 V 45 68 85 mA Total Supply Current vs. VDD IDQ VDD = 5 V 62 mA VDD = 6 V 65 mA VDD = 7 V 68 mA VDD = 8 V 72 mA SUPPLY VOLTAGE VDD 5 7 8 V Rev. E | Page 3 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE