Datasheet HMC8402 (Analog Devices) - 7

制造商Analog Devices
描述2 GHz to 30 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier
页数 / 页15 / 7 — Data Sheet. HMC8402. TYPICAL PERFORMANCE CHARACTERISTICS. +85°C. +25°C. …
修订版E
文件格式/大小PDF / 380 Kb
文件语言英语

Data Sheet. HMC8402. TYPICAL PERFORMANCE CHARACTERISTICS. +85°C. +25°C. –55°C. d (. INPUT RETURN LOSS. GAIN. OUTPUT RETURN LOSS. URN L. N (

Data Sheet HMC8402 TYPICAL PERFORMANCE CHARACTERISTICS +85°C +25°C –55°C d ( INPUT RETURN LOSS GAIN OUTPUT RETURN LOSS URN L N (

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文件文字版本

Data Sheet HMC8402 TYPICAL PERFORMANCE CHARACTERISTICS 20 16 +85°C 15 +25°C 15 –55°C 10 B) 14 d ( INPUT RETURN LOSS S 5 GAIN S 13 O OUTPUT RETURN LOSS 0 12 B) URN L d T –5 N ( 11 AI –10 G 10 N AND RE –15 9 AI G –20 8 –25 7 –30 0 4 8 12 16 20 24 28 32
008
6
1 1
2 6 10 14 18 22 26 30
0
FREQUENCY (GHz)
13853-
FREQUENCY (GHz)
13853- Figure 8. Response Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures
0 0 +85°C +85°C +25°C +25°C –2 –2 –55°C –55°C –4 –4 –6 –6 B) B) d d ( ( –8 S –8 S S S O O –10 –10 URN L –12 URN L –12 T T RE RE –14 –14 –16 –16 –18 –18 –20 –20
012
2 6 10 14 18 22 26 30
009
2 6 10 14 18 22 26 30 FREQUENCY (GHz) FREQUENCY (GHz)
13853- 13853- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures
6 6 +85°C 5V +25°C 6V –55°C 7V 5 5 8V ) ) 4 4 dB dB ( ( E E R R 3 3 FIGU FIGU E E OIS OIS 2 N 2 N 1 1 0 0
013
0 5 10 15 20 25 30
010
0 5 10 15 20 25 30 FREQUENCY (GHz) FREQUENCY (GHz)
13853- 13853- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. Noise Figure vs. Frequency at Various Supply Voltages Rev. E | Page 7 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE