Datasheet HMC8402 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 2 GHz to 30 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier |
| 页数 / 页 | 15 / 8 — HMC8402. Data Sheet. +85°C. +25°C. –55°C. d (. FREQUENCY (GHz). ) m. Bm). … |
| 修订版 | E |
| 文件格式/大小 | PDF / 380 Kb |
| 文件语言 | 英语 |
HMC8402. Data Sheet. +85°C. +25°C. –55°C. d (. FREQUENCY (GHz). ) m. Bm). dB (. B 1d. SAT. B d. 3 (d. 3 (. 4GHz. 6GHz. 10GHz. 16GHz. 20GHz. 24GHz. 26GHz
该数据表的模型线
文件文字版本
HMC8402 Data Sheet 26 26 +85°C +85°C +25°C +25°C –55°C 24 24 –55°C 22 22 ) ) m m B 20 B 20 (d d ( B T d 18 SA 18 P1 P 16 16 14 14 12 12 2 6 10 14 18 22 26 30
014
2 6 10 14 18 22 26 30
017 53- 53-
FREQUENCY (GHz)
138
FREQUENCY (GHz)
138 Figure 14. P1dB vs. Frequency at Various Temperatures Figure 17. PSAT vs. Frequency at Various Temperatures
26 26 5V 5V 6V 6V 24 7V 24 7V 8V 8V 22 22 ) m Bm) 20 20 (d dB ( B 1d 18 SAT 18 P P 16 16 14 14 12
5
12
8
2 6 10 14 18 22 26 30
01 01 3-
2 6 10 14 18 22 26 30
3-
FREQUENCY (GHz)
1385
FREQUENCY (GHz)
1385 Figure 15. P1dB vs. Frequency at Various Supply Voltages Figure 18. PSAT vs. Frequency at Various Supply Voltages
32 60 +85°C +25°C 30 –55°C 55 28 50 26 ) 45 m c) B 24 B d 40 3 (d 22 3 ( IP IM 35 20 4GHz 18 30 6GHz 10GHz 16GHz 16 25 20GHz 24GHz 26GHz 14
6
20 2 6 10 14 18 22 26 30
01 9 3-
0 1 2 3 4 5 6 7 8
01
FREQUENCY (GHz)
1385
POUT/TONE (dBm)
13853- Figure 16. Output IP3 vs. Frequency for Various Temperatures at Figure 19. Output Third Order Intermodulation (IM3) vs. POUT/Tone for POUT = 0 dBm/Tone Various Frequencies at VDD = 6 V Rev. E | Page 8 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
014
2 6 10 14 18 22 26 30
017 53- 53-
FREQUENCY (GHz)
138
FREQUENCY (GHz)
138 Figure 14. P1dB vs. Frequency at Various Temperatures Figure 17. PSAT vs. Frequency at Various Temperatures
26 26 5V 5V 6V 6V 24 7V 24 7V 8V 8V 22 22 ) m Bm) 20 20 (d dB ( B 1d 18 SAT 18 P P 16 16 14 14 12
5
12
8
2 6 10 14 18 22 26 30
01 01 3-
2 6 10 14 18 22 26 30
3-
FREQUENCY (GHz)
1385
FREQUENCY (GHz)
1385 Figure 15. P1dB vs. Frequency at Various Supply Voltages Figure 18. PSAT vs. Frequency at Various Supply Voltages
32 60 +85°C +25°C 30 –55°C 55 28 50 26 ) 45 m c) B 24 B d 40 3 (d 22 3 ( IP IM 35 20 4GHz 18 30 6GHz 10GHz 16GHz 16 25 20GHz 24GHz 26GHz 14
6
20 2 6 10 14 18 22 26 30
01 9 3-
0 1 2 3 4 5 6 7 8
01
FREQUENCY (GHz)
1385
POUT/TONE (dBm)
13853- Figure 16. Output IP3 vs. Frequency for Various Temperatures at Figure 19. Output Third Order Intermodulation (IM3) vs. POUT/Tone for POUT = 0 dBm/Tone Various Frequencies at VDD = 6 V Rev. E | Page 8 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE