Datasheet HMC8402 (Analog Devices) - 9
| 制造商 | Analog Devices |
| 描述 | 2 GHz to 30 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier |
| 页数 / 页 | 15 / 9 — Data Sheet. HMC8402. Bc). 3 (. 4GHz. 4GHz 6GHz. 6GHz. 10GHz. 16GHz. 16GHz … |
| 修订版 | E |
| 文件格式/大小 | PDF / 380 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC8402. Bc). 3 (. 4GHz. 4GHz 6GHz. 6GHz. 10GHz. 16GHz. 16GHz 20GHz. 20GHz. 24GHz. 26GHz. OUT/TONE (dBm). 160. +85°C +25°C. –10. –55°C. 140. –20
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Data Sheet HMC8402 60 60 55 55 50 50 45 45 Bc) Bc) d d 40 40 3 ( 3 ( IM IM 35 35 4GHz 4GHz 6GHz 30 6GHz 30 10GHz 10GHz 16GHz 16GHz 20GHz 25 20GHz 25 24GHz 24GHz 26GHz 26GHz 20 20 0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 8
023 020
P P OUT/TONE (dBm) OUT/TONE (dBm)
13853- 13853- Figure 20. Output (IM3) vs. POUT/Tone for Various Frequencies at VDD = 7 V Figure 23. Output (IM3) vs. POUT/Tone for Various Frequencies at VDD = 8 V
0 25 160 +85°C +25°C –10 –55°C %) 20 140 ( –20 AE ) , P dB –30 B) 15 120 ( d N ( mA) ( TION –40 AI I DD , G OLA 10 100 –50 IS Bm) (d –60 UT OP 5 POUT 80 GAIN –70 PAE IDD –80 0 60
024
2 6 10 14 18 22 26 30
021
–10 –8 –6 –4 –2 0 2 4 6 8 10 12 FREQUENCY (GHz) INPUT POWER (dBm)
13853- 13853- Figure 21. Reverse Isolation vs. Frequency at Various Temperatures Figure 24. Power Compression at 16 GHz
1.2 16 5V 6V 15 1.1 7V 8V 14 ) 1.0 (W 13 N IO 0.9 T 12 B) d PA 0.8 N ( 11 ISSI AI D G 10 ER 0.7 W 4GHz 9 PO 0.6 6GHz 10GHz 8 16GHz 0.5 20GHz 24GHz 7 26GHz 0.4 6
025
–10 –8 –6 –4 –2 0 2 4 6 8 10 12
022
0 5 10 15 20 25 30 INPUT POWER (dBm) FREQUENCY (GHz)
13853- 13853- Figure 22. Power Dissipation vs. Input Power at Various Frequencies, T Figure 25. Gain vs. Frequency at Various Supply Voltages A = 85°C Rev. E | Page 9 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
023 020
P P OUT/TONE (dBm) OUT/TONE (dBm)
13853- 13853- Figure 20. Output (IM3) vs. POUT/Tone for Various Frequencies at VDD = 7 V Figure 23. Output (IM3) vs. POUT/Tone for Various Frequencies at VDD = 8 V
0 25 160 +85°C +25°C –10 –55°C %) 20 140 ( –20 AE ) , P dB –30 B) 15 120 ( d N ( mA) ( TION –40 AI I DD , G OLA 10 100 –50 IS Bm) (d –60 UT OP 5 POUT 80 GAIN –70 PAE IDD –80 0 60
024
2 6 10 14 18 22 26 30
021
–10 –8 –6 –4 –2 0 2 4 6 8 10 12 FREQUENCY (GHz) INPUT POWER (dBm)
13853- 13853- Figure 21. Reverse Isolation vs. Frequency at Various Temperatures Figure 24. Power Compression at 16 GHz
1.2 16 5V 6V 15 1.1 7V 8V 14 ) 1.0 (W 13 N IO 0.9 T 12 B) d PA 0.8 N ( 11 ISSI AI D G 10 ER 0.7 W 4GHz 9 PO 0.6 6GHz 10GHz 8 16GHz 0.5 20GHz 24GHz 7 26GHz 0.4 6
025
–10 –8 –6 –4 –2 0 2 4 6 8 10 12
022
0 5 10 15 20 25 30 INPUT POWER (dBm) FREQUENCY (GHz)
13853- 13853- Figure 22. Power Dissipation vs. Input Power at Various Frequencies, T Figure 25. Gain vs. Frequency at Various Supply Voltages A = 85°C Rev. E | Page 9 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 18 GHz FREQUENCY RANGE 18 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE