Datasheet HMC1049 (Analog Devices) - 9
| 制造商 | Analog Devices |
| 描述 | GaAs pHEMT MMIC Low Noise Amplifier, 0.3 GHz to 20 GHz |
| 页数 / 页 | 14 / 9 — Data Sheet. HMC1049. TA = +85°C. GAIN. TA = +25°C. POUT. TA = –55°C. PAE. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 272 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC1049. TA = +85°C. GAIN. TA = +25°C. POUT. TA = –55°C. PAE. –10. ( AE. , P. –15. d N (. –20. TION. AI , G. OLA. –25. Bm) d (. –30. UT O. –35. –40. –12
该数据表的模型线
文件文字版本
Data Sheet HMC1049 0 20 TA = +85°C GAIN TA = +25°C POUT –5 TA = –55°C PAE 16 %) –10 ( AE ) , P –15 dB B) ( 12 d N ( –20 TION AI , G OLA 8 –25 IS Bm) d ( –30 UT O 4 P –35 –40 0 0 2 4 6 8 10 12 14 16 18 20 22
024
–15 –12 –9 –6 –3 0 3 6
027
FREQUENCY (GHz)
12956-
INPUT POWER (dBm)
12956- Figure 22. Reverse Isolation vs. Temperature Figure 25. Power Compression at 18 GHz
20 21 NOISE FIGURE GAIN Bm) 18 d PSAT 16 ( %) ( AT S AE 15 ), P , P dB B) 12 ( d 12 IN N ( AI ), GA , G 9 8 dB ( Bm) E d R ( 6 UT O 4 P FIGU E GAIN 3 P OIS OUT N PAE 0 0 –15 –12 –9 –6 –3 0 3 6
025
6.0 6.5 7.0 7.5 8.0
028
INPUT POWER (dBm)
12956-
VDD (V)
12956- Figure 23. Power Compression at 2 GHz Figure 26. Noise Figure, Gain, and Power (PSAT) vs. Supply Voltage (VDD) at 12 GHz
20 18 NOISE FIGURE GAIN Bm) d P 15 SAT 16 %) ( ( AT S AE ), P , P 12 B) dB 12 d ( IN N ( AI 9 ), GA , G 8 dB ( Bm) E d 6 ( R UT O 4 P FIGU E GAIN 3 POUT OIS N PAE 0 0 –15 –12 –9 –6 –3 0 3 6
026
50 60 70 80
029
INPUT POWER (dBm)
12956-
IDD (mA)
12956- Figure 24. Power Compression at 10 GHz Figure 27. Noise Figure, Gain, and Power vs. Supply Current at 12 GHz Rev. B | Page 9 of 14 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings ESD Caution PIN Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Application Circuit Assembly Diagram Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide
024
–15 –12 –9 –6 –3 0 3 6
027
FREQUENCY (GHz)
12956-
INPUT POWER (dBm)
12956- Figure 22. Reverse Isolation vs. Temperature Figure 25. Power Compression at 18 GHz
20 21 NOISE FIGURE GAIN Bm) 18 d PSAT 16 ( %) ( AT S AE 15 ), P , P dB B) 12 ( d 12 IN N ( AI ), GA , G 9 8 dB ( Bm) E d R ( 6 UT O 4 P FIGU E GAIN 3 P OIS OUT N PAE 0 0 –15 –12 –9 –6 –3 0 3 6
025
6.0 6.5 7.0 7.5 8.0
028
INPUT POWER (dBm)
12956-
VDD (V)
12956- Figure 23. Power Compression at 2 GHz Figure 26. Noise Figure, Gain, and Power (PSAT) vs. Supply Voltage (VDD) at 12 GHz
20 18 NOISE FIGURE GAIN Bm) d P 15 SAT 16 %) ( ( AT S AE ), P , P 12 B) dB 12 d ( IN N ( AI 9 ), GA , G 8 dB ( Bm) E d 6 ( R UT O 4 P FIGU E GAIN 3 POUT OIS N PAE 0 0 –15 –12 –9 –6 –3 0 3 6
026
50 60 70 80
029
INPUT POWER (dBm)
12956-
IDD (mA)
12956- Figure 24. Power Compression at 10 GHz Figure 27. Noise Figure, Gain, and Power vs. Supply Current at 12 GHz Rev. B | Page 9 of 14 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings ESD Caution PIN Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Application Circuit Assembly Diagram Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide