Datasheet HMC1049 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | GaAs pHEMT MMIC Low Noise Amplifier, 0.3 GHz to 20 GHz |
| 页数 / 页 | 14 / 10 — HMC1049. Data Sheet. TA = +85°C. TA = +25°C. TA = –55°C. SE (d. Bm). N … |
| 修订版 | B |
| 文件格式/大小 | PDF / 272 Kb |
| 文件语言 | 英语 |
HMC1049. Data Sheet. TA = +85°C. TA = +25°C. TA = –55°C. SE (d. Bm). N –10. d 3 (. –15. ESPO R –20. –25. –30. S21. –35. S11 S22. –40. FREQUENCY (GHz)
该数据表的模型线
文件文字版本
HMC1049 Data Sheet
Data taken with VDD = 4 V applied to the bias tee at Pad 4.
20 35 TA = +85°C 15 TA = +25°C TA = –55°C 10 30 5 ) 0 B –5 25 SE (d Bm) N –10 d 3 ( –15 IP 20 ESPO R –20 –25 15 –30 S21 –35 S11 S22 –40 10 0 4 8 12 16 20 24
030
0 2 4 6 8 10 12 14 16 18 20
033
FREQUENCY (GHz)
12956-
FREQUENCY (GHz)
12956- Figure 28. Broadband Gain and Return Loss Figure 31. Output IP3 vs. Temperature
20 20 TA = +85°C TA = +85°C TA = +25°C TA = +25°C 18 TA = –55°C TA = –55°C 17 16 14 B) 14 d Bm) d N ( B ( AI 12 G 1d P 11 10 8 8 6 5 0 2 4 6 8 10 12 14 16 18 20 22
031
0 2 4 6 8 10 12 14 16 18 20
034
FREQUENCY (GHz)
12956-
FREQUENCY (GHz)
12956- Figure 29. Gain vs. Temperature Figure 32. P1dB vs. Temperature
6 23 TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –55°C TA = –55°C 5 20 ) 4 dB ( E 17 R Bm) d 3 ( FIGU AT E SP 14 OIS 2 N 11 1 0 8 0 2 4 6 8 10 12 14 16 18 20
032
0 2 4 6 8 10 12 14 16 18 20
035
FREQUENCY (GHz)
12956-
FREQUENCY (GHz)
12956- Figure 30. Noise Figure vs. Temperature Figure 33. PSAT vs. Temperature Rev. B | Page 10 of 14 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings ESD Caution PIN Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Application Circuit Assembly Diagram Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide
Data taken with VDD = 4 V applied to the bias tee at Pad 4.
20 35 TA = +85°C 15 TA = +25°C TA = –55°C 10 30 5 ) 0 B –5 25 SE (d Bm) N –10 d 3 ( –15 IP 20 ESPO R –20 –25 15 –30 S21 –35 S11 S22 –40 10 0 4 8 12 16 20 24
030
0 2 4 6 8 10 12 14 16 18 20
033
FREQUENCY (GHz)
12956-
FREQUENCY (GHz)
12956- Figure 28. Broadband Gain and Return Loss Figure 31. Output IP3 vs. Temperature
20 20 TA = +85°C TA = +85°C TA = +25°C TA = +25°C 18 TA = –55°C TA = –55°C 17 16 14 B) 14 d Bm) d N ( B ( AI 12 G 1d P 11 10 8 8 6 5 0 2 4 6 8 10 12 14 16 18 20 22
031
0 2 4 6 8 10 12 14 16 18 20
034
FREQUENCY (GHz)
12956-
FREQUENCY (GHz)
12956- Figure 29. Gain vs. Temperature Figure 32. P1dB vs. Temperature
6 23 TA = +85°C TA = +85°C TA = +25°C TA = +25°C TA = –55°C TA = –55°C 5 20 ) 4 dB ( E 17 R Bm) d 3 ( FIGU AT E SP 14 OIS 2 N 11 1 0 8 0 2 4 6 8 10 12 14 16 18 20
032
0 2 4 6 8 10 12 14 16 18 20
035
FREQUENCY (GHz)
12956-
FREQUENCY (GHz)
12956- Figure 30. Noise Figure vs. Temperature Figure 33. PSAT vs. Temperature Rev. B | Page 10 of 14 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings ESD Caution PIN Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Application Circuit Assembly Diagram Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide