14 /9 — Data Sheet. HMC1040CHIPS. Bm). d (. B (. 2.0V. 2.5V. 3.0V. FREQUENCY …
文件格式/大小
PDF / 351 Kb
文件语言
英语
Data Sheet. HMC1040CHIPS. Bm). d (. B (. 2.0V. 2.5V. 3.0V. FREQUENCY (GHz). E (%. OUT. GAIN. PAE. mA). I DD. –15. –13. –11. INPUT POWER (dBm). 0.15. 0.14. 0.13
Data SheetHMC1040CHIPS18181616141412Bm)12Bm)dd (B (AT1d10S10PP2.0V2.0V82.5V82.5V3.0V3.0V664420222426283032343638404244 019 20222426283032343638404244 022 FREQUENCY (GHz) 16709- FREQUENCY (GHz) 16709- Figure 19. P1dB vs. Frequency for Various Supply Voltages Figure 22. PSAT vs. Frequency for Various Supply Voltages 2874247424722072))PPE (%OUTE (%OUTGAINGAIN20701670PAPAEPAPAE),I),IBDDBDD(d(dmA)mA)IN1668(IN1268(AAGI DDGI DD),),BB1266866(d(dUTUTOOPP864464462062–15–13–11–9–7–5 020 –15–13–11–9–7–5–3–1 023 INPUT POWER (dBm)INPUT POWER (dBm) 16709- 16709- Figure 20. Output Power (POUT), Gain, Power Added Efficiency (PAE), and IDD Figure 23. POUT, Gain, PAE, and IDD with RF Applied vs. Input Power at 42 GHz with RF Applied vs. Input Power at 22 GHz 28740.150.142472)P)0.13E (%OUTGAIN2070(WPAPAEN),IBDDIO0.12T(dmA)IN1668PA(22GHzA0.1124GHzGI DDISSI),26GHzBD28GHz12660.10(dER30GHzUTW32GHzOPPO0.0934GHz86436GHz 38GHz0.0840GHz 42GHz462–15–13–11–9–7–5–3 021 0.07INPUT POWER (dBm)–15 –14 –13 –12 –11 –10–9–8–7–6–5–4–3–2 024 16709- INPUT POWER (dBm) 16709- Figure 21. POUT, Gain, PAE, and IDD with RF Applied vs. Input Power at 33 GHz Figure 24. Power Dissipation vs. Input Power for Various Frequencies, TA = 85°C Rev. 0 | Page 9 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE