HMC902Data SheetTYPICAL PERFORMANCE CHARACTERISTICS2525+85°C+25°C–55°CSS (dB) O1523TURN L521dB) N (N AND REAI GAI–519–1517ADBAND GS11BROS21S22–251535791113 008 4567891011 110 FREQUENCY (GHz) 14525- FREQUENCY (GHz) 14525- Figure 8. Broadband Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures 00+85°C+85°C+25°C+25°C–55°C–5–40°C–5–10–10SS (dB)SS (dB)OO–15–15TURN LTURN LREREUT–20PUT–20INPUT O–25–25–30–304567891011 009 567891011 012 FREQUENCY (GHz) 14525- FREQUENCY (GHz) 14525- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures 635+85°C+25°C–55°C530)425E (dB RdBm)3IP3 (20E FIGUPUTOIS N2UT O15110+85°C+25°C–40°C0 4567891011 010 5 5678910 013 FREQUENCY (GHz) 14525- FREQUENCY (GHz) 14525- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. Output IP3 vs. Frequency at Various Temperatures Rev. D | Page 6 of 13 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE