Datasheet HMC753 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | 1 GHz to 11 GHz, GaAs, HEMT, MMIC Low Noise Amplifier |
| 页数 / 页 | 13 / 5 — Data Sheet. HMC753. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. GND 1. … |
| 修订版 | E |
| 文件格式/大小 | PDF / 282 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC753. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. GND 1. 18 GND. GND 2. 17 GND. RFIN 3. 16 RFOUT. TOP VIEW. GND 4. 15 GND
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Data Sheet HMC753 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS D D C C C C GN NI NI NI NI GN 4 3 2 1 0 9 2 2 2 2 2 1 GND 1 18 GND GND 2 17 GND RFIN 3 HMC753 16 RFOUT TOP VIEW GND 4 15 GND (Not to Scale) GND 5 14 GND GND 6 13 GND 7 8 9 0 1 2 1 1 1 D 2 1 C D DD NI GN GG GG V V V GN NOTES 1. NIC = NOT INTERNALLY CONNECTED. THESE PINS ARE NOT INTERNALLY CONNECTED; HOWEVER, ALL DATA SHOWN IS MEASURED WITH THESE PINS CONNECTED EXTERNALLY TO RF/DC GROUND.
-002
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
94
CONNECTED TO RF/DC GROUND.
134 Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 2, 4 to 7, 12 to 15, 17 GND Ground. The package bottom has an exposed metal pad that must be connected to RF/dc to 19, 24 ground. 3 RFIN RF Input. This pad is ac-coupled and matched to 50 Ω. 8, 9 VGG2, VGG1 Gate Control for the Amplifier. Follow the biasing procedures described in the Biasing Procedure section. See Figure 23 for required external components. 10 VDD Power Supply Voltage for the Amplifier. See Figure 23 for required external components. 11, 20 to 23 NC Not Internally Connected. These pins are not internally connected; however, all data shown is measured with these pins connected externally to RF/dc ground. 16 RFOUT RF Output. This pad is ac-coupled and matched to 50 Ω. EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground. Rev. E | Page 5 of 13 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Evaluation PCB Outline Dimensions Ordering Guide
Data Sheet HMC753 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS D D C C C C GN NI NI NI NI GN 4 3 2 1 0 9 2 2 2 2 2 1 GND 1 18 GND GND 2 17 GND RFIN 3 HMC753 16 RFOUT TOP VIEW GND 4 15 GND (Not to Scale) GND 5 14 GND GND 6 13 GND 7 8 9 0 1 2 1 1 1 D 2 1 C D DD NI GN GG GG V V V GN NOTES 1. NIC = NOT INTERNALLY CONNECTED. THESE PINS ARE NOT INTERNALLY CONNECTED; HOWEVER, ALL DATA SHOWN IS MEASURED WITH THESE PINS CONNECTED EXTERNALLY TO RF/DC GROUND.
-002
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
94
CONNECTED TO RF/DC GROUND.
134 Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1, 2, 4 to 7, 12 to 15, 17 GND Ground. The package bottom has an exposed metal pad that must be connected to RF/dc to 19, 24 ground. 3 RFIN RF Input. This pad is ac-coupled and matched to 50 Ω. 8, 9 VGG2, VGG1 Gate Control for the Amplifier. Follow the biasing procedures described in the Biasing Procedure section. See Figure 23 for required external components. 10 VDD Power Supply Voltage for the Amplifier. See Figure 23 for required external components. 11, 20 to 23 NC Not Internally Connected. These pins are not internally connected; however, all data shown is measured with these pins connected externally to RF/dc ground. 16 RFOUT RF Output. This pad is ac-coupled and matched to 50 Ω. EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground. Rev. E | Page 5 of 13 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Evaluation PCB Outline Dimensions Ordering Guide