Datasheet HMC504LC4B (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | GaAs HEMT MMIC LOW NOISE AMPLIFIER, 14 - 27 GHz |
| 页数 / 页 | 6 / 4 — HMC504LC4B. GaAs HEMT MMIC LOW NOISE. AMPLIFIER, 14 - 27 GHz. Absolute … |
| 文件格式/大小 | PDF / 1.3 Mb |
| 文件语言 | 英语 |
HMC504LC4B. GaAs HEMT MMIC LOW NOISE. AMPLIFIER, 14 - 27 GHz. Absolute Maximum Ratings
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HMC504LC4B
v05.0918
GaAs HEMT MMIC LOW NOISE AMPLIFIER, 14 - 27 GHz Absolute Maximum Ratings
Drain Bias Voltage +4.5V RF Input Power +6 dBm ELECTROSTATIC SENSITIVE DEVICE T Gate Bias Voltage -2 to 0.3V OBSERVE HANDLING PRECAUTIONS M Channel Temperature 180 °C Continuous Pdiss (T = 85 °C) 1.9 W (derate 20 mW/°C above 85 °C) Thermal Resistance E - S 50 °C/W (Channel to ground paddle) IS Storage Temperature -65 to +150 °C O Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 1A
24-Terminal Ceramic Leadless Chip Carrier [LCC]
W N
(E-24-2) Dimensions shown in millimeters.
O
Outline Drawing
S - L
4.05 0.36
R
3.90 SQ 0.30 PIN 1 3.75 0.08 0.24
IE
INDICATOR BSC PIN 1 19 24 18 1
LIF
0.50
P
BSC 2.60 EXPOSED PAD 2.50 SQ
M
2.40
A
13 6 12 7 TOP VIEW 0.32 BOTTOM VIEW BSC 2.50 REF 1.20 3.10 BSC 1.10 SIDE VIEW 1.00 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND SEATING FUNCTION DESCRIPTIONS PLANE SECTION OF THIS DATA SHEET. PKG-004841 02-27-2017-A
24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-2) Dimensions shown in mil imeters
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC504LC4B Alumina, White Gold over Nickel MSL3 [1] H504 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
4
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Gain, Noise Figure & Power vs. Supply Voltage @ 21 GHz Power Compression @ 21 GHz Reverse Isolation vs. Temperature Psat vs. Temperature P1dB vs. Temperature Output IP3 vs. Temperature Noise Figure vs. Temperature Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Broadband Gain & Return Loss Absolute Maximum Ratings Outline Drawing Pin Descriptions Application Circuit Evaluation PCB List of Materials
v05.0918
GaAs HEMT MMIC LOW NOISE AMPLIFIER, 14 - 27 GHz Absolute Maximum Ratings
Drain Bias Voltage +4.5V RF Input Power +6 dBm ELECTROSTATIC SENSITIVE DEVICE T Gate Bias Voltage -2 to 0.3V OBSERVE HANDLING PRECAUTIONS M Channel Temperature 180 °C Continuous Pdiss (T = 85 °C) 1.9 W (derate 20 mW/°C above 85 °C) Thermal Resistance E - S 50 °C/W (Channel to ground paddle) IS Storage Temperature -65 to +150 °C O Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 1A
24-Terminal Ceramic Leadless Chip Carrier [LCC]
W N
(E-24-2) Dimensions shown in millimeters.
O
Outline Drawing
S - L
4.05 0.36
R
3.90 SQ 0.30 PIN 1 3.75 0.08 0.24
IE
INDICATOR BSC PIN 1 19 24 18 1
LIF
0.50
P
BSC 2.60 EXPOSED PAD 2.50 SQ
M
2.40
A
13 6 12 7 TOP VIEW 0.32 BOTTOM VIEW BSC 2.50 REF 1.20 3.10 BSC 1.10 SIDE VIEW 1.00 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND SEATING FUNCTION DESCRIPTIONS PLANE SECTION OF THIS DATA SHEET. PKG-004841 02-27-2017-A
24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-2) Dimensions shown in mil imeters
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC504LC4B Alumina, White Gold over Nickel MSL3 [1] H504 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
4
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Gain, Noise Figure & Power vs. Supply Voltage @ 21 GHz Power Compression @ 21 GHz Reverse Isolation vs. Temperature Psat vs. Temperature P1dB vs. Temperature Output IP3 vs. Temperature Noise Figure vs. Temperature Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Broadband Gain & Return Loss Absolute Maximum Ratings Outline Drawing Pin Descriptions Application Circuit Evaluation PCB List of Materials