Datasheet HMC618ALP3E (Analog Devices) - 10

HMC618ALP3E
v01.0519
GaAs SMT pHEMT LOW NOISE AMPLIFIER, 1.2 - 2.2 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd Rbias = 10 KOhm for 3V
Drain Bias Voltage (Vdd1, Vdd2) +6V T RF Input Power (RFIN)
Rbias = 470 Ohm for 5V
+10 dBm M (Vdd = +5 Vdc) Vdd (Vdc) Idd (mA) Channel Temperature 150 °C 2.7 35 Continuous Pdiss (T= 85 °C) 0.63 W 3.0 47 (derate 9.68 mW/°C above 85 °C) E - S 3.3 58 Thermal Resistance 103.4 °C/W IS (channel to ground paddle) 4.5 72 5.0 89 O Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C 5.5 106 ESD Sensitivity (HBM) Class 1A, Passed 250V Note: Amplifier will operate over full voltage ranges shown above. W N O
16-Lead Lead Frame Chip Scale Package [LFCSP
ELECTROSTATIC SENSITI
3 x 3 mm Body and 0.85 mm Package Height
VE DEVICE
(CP-16-50)
OBSERVE HANDLING PRECAUTIONS
Dimensions shown in millimeters Outline Drawing
S - L R
DETAIL A (JEDEC 95) 3.10 0.30
IE
3.00 SQ 0.25 PIN 1 INDICATOR 2.90 0.20 AREA PIN 1
LIF
INDICATOR AREA OPTIONS 0.50 13 16 (SEE DETAIL A) 12 1
P
BSC 1.70
M
EXPOSED 1.60 SQ PAD
A
1.50 9 4 8 5 0.45 0.20 MIN TOP VIEW BOTTOM VIEW 0.40 0.35 0.90 FOR PROPER CONNECTION OF 0.85 0.05 MAX THE EXPOSED PAD, REFER TO 0.80 0.02 NOM THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS COPLANARITY SECTION OF THIS DATA SHEET. SEATING 0.08 PLANE 0.203 REF PKG-004831 COMPLIANT TO JEDEC STANDARDS MO-220-VEED-4 08-30-2018-A
16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.85 mm Package Height (CP-16-50) Dimensions shown in millimeters
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC618ALP3E Alumina White Gold over Nickel MSL3 [1] 618A XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
10
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications 1200 to 1700 MHz Tune Gain vs. Temperature Gain vs. Temperature Input Return Loss vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Output Return Loss vs. Temperature Reverse Isolation vs. Temperature Reverse Isolation vs. Temperature Noise Figure vs. Temperature Noise Figure vs. Temperature Output P1dB vs. Temperature Output P1dB vs. Temperature Psat vs. Temperature Psat vs. Temperature Output IP3 vs. Temperature Output IP3 vs. Temperature 1700 to 2200 MHz Tune Broadband Gain & Return Loss Gain vs. Temperature Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Reverse Isolation vs. Temperature Noise Figure vs Temperature Output P1dB vs. Temperature Psat vs. Temperature Output IP3 vs. Temperature Output IP3 and Idd vs. Supply Voltage @ 1750 MHz Output IP3 and Idd vs. Supply Voltage @ 1750 MHz Output IP3 and Idd vs. Supply Voltage @ 2100 MHz Output IP3 and Idd vs. Supply Voltage @ 2100 MHz Power Compression @ 1750 MHz Power Compression @ 1750 MHz Power Compression @ 2100 MHz Power Compression @ 2100 MHz Gain, Power & Noise Figure vs. Supply Voltage @ 1750 MHz Gain, Power & Noise Figure vs. Supply Voltage @ 1750 MHz Gain, Power & Noise Figure vs. Supply Voltage @ 2100 MHz Gain, Power & Noise Figure vs. Supply Voltage @ 2100 MHz Output IP3 vs. Rbias @ 1750 MHz Gain, Noise Figure vs. Rbias @ 1750 MHz Output IP3 vs. Rbias @ 2100 MHz Gain, Noise Figure vs. Rbias @ 2100 MHz Absolute Bias Resistor Range & Recommended Bias Resistor Values for Idd Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Package Information Pin Descriptions Evaluation PCB 1700 to 2200 MHz Tune Application Circuit Evaluation PCB Ordering Information List of Materials 1200 to 1700 MHz Tune Application Circuit Evaluation PCB Ordering Information List of Materials