Datasheet HMC373LP3, 373LP3E (Analog Devices) - 5

HMC373LP3 / 373LP3E
v04.1119
GaAs PHEMT MMIC LOW NOISE AMPLIFIER w/ BYPASS MODE, 700 - 1000 MHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +8.0 Vdc Vdd (Vdc) Idd (mA) RF Input Power (RFIN) LNA Mode +15 dBm +4.5 87 T (Vdd = +5.0 Vdc) Bypass Mode +30 dBm +5.0 90 M Channel Temperature 150 °C +5.5 93 S Continuous Pdiss (T = 85 °C) 0.878 W - (derate 13.5 mW/°C above 85 °C) E Thermal Resistance
Truth Table
74.1 °C/W (channel to ground paddle) IS LNA Mode Vctl= Short Circuit to DC Ground Storage Temperature -65 to +150° C O Bypass Mode Vctl= Open Circuit Operating Temperature -40 to +85° C N W ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
16-Lead Lead Frame Chip Scale Package [LFCSP]
LO
3 x 3 mm Body and 0.85 mm Package Height
-
Outline Drawing (HCP-16-1) Dimensions shown in millimeters
S R
DETAIL A (JEDEC 95)
IE
3.10 0.30 3.00 SQ 0.25 PIN 1 2.90 0.20
LIF
INDICATOR PIN 1 INDICATOR AREA OPTIONS 0.50 13 16 (SEE DETAIL A)
P
12 1 BSC EXPOSED
M
1.95 PAD 1.70 SQ
A
1.50 9 4 0.45 8 5 0.20 MIN TOP VIEW BOTTOM VIEW 0.40 0.35 0.90 0.85 0.05 MAX 0.80 0.02 NOM COPLANARITY SEATING 0.08 PLANE 0.20 REF PKG-004863 COMPLIANT WITH JEDEC STANDARDS MO-220-VEED-4. 03-15-2017-B
16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.85 mm Package Height (HCP-16-1) Dimensions shown in mil imeters
Package Information
Part Number Package Body Material Lead Finish MSL Rating [1] Package Marking [2] 373 HMC373LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 XXXX 373 HMC373LP3ETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D