Datasheet ADPA1105 (Analog Devices) - 4

ADPA1105 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (VDD1, VDD2) 55 V dc (PCB) design and operating environment. Careful attention to Gate Bias Voltage (VGG1, VGG2) −5 V to 0 V dc the PCB thermal design is required. Radio Frequency Input Power (RFIN) 30 dBm θJC is the junction to case thermal resistance (°C/W) of the device. Maximum Drain Bias Pulse Width 500 μs
Table 4. Thermal Resistance
Duty Cycle 20%
Package Type1 θJC Unit
Drain Bias Pulse Width = 100 μs at 10% Duty Cycle CG-32-2 Maximum Pulsed Power Dissipation (PDISS), 54.5 W Drain Bias Pulse Width = 100 μs2 2.11 °C/W Base Temperature (TBASE) = 85°C, Derate Drain Bias Pulse Width = 200 μs3 2.82 °C/W 473 mW/°C Above 85°C 1 Nominal Pulsed Peak Channel Temperature, 155.9°C The θJC value was determined by measuring θJC under the following conditions: the heat transfer is solely because of the thermal conduction PIN = 19 dBm, PDISS = 33.6 W at 0.9 GHz from the channel through the ground pad to the PCB, and the ground pad is Drain Bias Pulse Width = 200 μs at 20% Duty Cycle held constant at the operating temperature of 85°C. 2 Maximum Pulsed Power Dissipation (P At 10% duty cycle. DISS) 40.8 W 3 At 20% duty cycle. (Base Temperature (TBASE) = 85°C, Derate 355 mW/°C Above 85°C)
ELECTROSTATIC DISCHARGE (ESD) RATINGS
Nominal Pulsed Peak Channel Temperature 179.7°C The following ESD information is provided for handling of PIN = 19 dBm, PDISS = 33.6 W at 0.9 GHz
1
ESD-sensitive devices in an ESD protected area only. Maximum Channel Temperature 200°C Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Maximum Peak Reflow Temperature 260°C Storage Temperature Range −60°C to
ESD Ratings for ADPA1105
+125°C Operating Temperature Range −40°C to +85°C
Table 5. ADPA1105, 32-Lead LFCSP_CAV ESD Model Withstand Threshold (V) Class
1 Worst case frequency for PDISS. HBM 250 1A Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any
ESD CAUTION
other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD Ratings for ADPA1105 ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BASIC CONNECTIONS THERMAL MANAGEMENT OUTLINE DIMENSIONS ORDERING GUIDE