Datasheet ADPA7005CHIP (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | GaAs, pHEMT, MMIC,1 W Power Amplifier, 20 GHz to 44 GHz |
| 页数 / 页 | 23 / 8 — ADPA7005CHIP. Data Sheet. +85°C +25°C –55°C. –10. URN L. –15. INP. UT O. … |
| 文件格式/大小 | PDF / 522 Kb |
| 文件语言 | 英语 |
ADPA7005CHIP. Data Sheet. +85°C +25°C –55°C. –10. URN L. –15. INP. UT O. –20. 1600mA 1400mA 1200mA. –25. FREQUENCY (GHz). 1600mA 1400mA. 1200mA
该数据表的模型线
文件文字版本
ADPA7005CHIP Data Sheet 0 0 +85°C +25°C –55°C –5 –5 B) B) d d ( ( S S S S O O –10 –10 URN L URN L T T –15 RE –15 RE UT UT P INP UT O –20 –20 1600mA 1400mA 1200mA –25 –25 20 22 24 26 28 30 32 34 36 38 40 42 44
016
20 22 24 26 28 30 32 34 36 38 40 42 44
019
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 16. Input Return Loss vs. Frequency for Various IDQ, VDD = 5 V Figure 19. Output Return Loss vs. Frequency for Various Temperature, VDD = 5 V, IDQ = 1200 mA
0 0 1600mA 1400mA –5 1200mA –5 B) B) d d ( ( S S S –10 S O O –10 URN L –15 URN L T T RE RE –15 UT UT P –20 P UT UT O O –20 –25 4V 5V –30 –25 20 22 24 26 28 30 32 34 36 38 40 42 44
017
20 22 24 26 28 30 32 34 36 38 40 42 44
020
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 17. Output Return Loss vs Frequency for Various VDD, IDQ = 1200 mA Figure 20. Output Return Loss vs. Frequency for Various IDQ, VDD = 5 V
0 12 +85°C +85°C +25°C +25°C –10 –55°C 10 –55°C ) B –20 (d ) N 8 dB IO ( T E A –30 R L 6 SO –40 FIGU E SE I OIS N 4 EVER –50 R 2 –60 –70 0 20 22 24 26 28 30 32 34 36 38 40 42 44
018
20 22 24 26 28 30 32 34 36 38 40 42 44
021
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 18. Reverse Isolation vs. Frequency for Various Temperatures, Figure 21. Noise Figure vs. Frequency for Various Temperatures, VDD = 5 V, VDD = 5 V, IDQ = 1200 mA IDQ = 1200 mA Rev. 0 | Page 8 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding BIASING ADPA7005CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR ADPA7005CHIP VGGx ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
016
20 22 24 26 28 30 32 34 36 38 40 42 44
019
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 16. Input Return Loss vs. Frequency for Various IDQ, VDD = 5 V Figure 19. Output Return Loss vs. Frequency for Various Temperature, VDD = 5 V, IDQ = 1200 mA
0 0 1600mA 1400mA –5 1200mA –5 B) B) d d ( ( S S S –10 S O O –10 URN L –15 URN L T T RE RE –15 UT UT P –20 P UT UT O O –20 –25 4V 5V –30 –25 20 22 24 26 28 30 32 34 36 38 40 42 44
017
20 22 24 26 28 30 32 34 36 38 40 42 44
020
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 17. Output Return Loss vs Frequency for Various VDD, IDQ = 1200 mA Figure 20. Output Return Loss vs. Frequency for Various IDQ, VDD = 5 V
0 12 +85°C +85°C +25°C +25°C –10 –55°C 10 –55°C ) B –20 (d ) N 8 dB IO ( T E A –30 R L 6 SO –40 FIGU E SE I OIS N 4 EVER –50 R 2 –60 –70 0 20 22 24 26 28 30 32 34 36 38 40 42 44
018
20 22 24 26 28 30 32 34 36 38 40 42 44
021
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 18. Reverse Isolation vs. Frequency for Various Temperatures, Figure 21. Noise Figure vs. Frequency for Various Temperatures, VDD = 5 V, VDD = 5 V, IDQ = 1200 mA IDQ = 1200 mA Rev. 0 | Page 8 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding BIASING ADPA7005CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR ADPA7005CHIP VGGx ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE