Datasheet ADMV7810 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 81 GHz to 86 GHz, 1 W E-Band Power Amplifier with Power Detector |
| 页数 / 页 | 18 / 7 — Data Sheet. ADMV7810. TYPICAL PERFORMANCE CHARACTERISTICS. A = +85°C. TA … |
| 修订版 | A |
| 文件格式/大小 | PDF / 435 Kb |
| 文件语言 | 英语 |
Data Sheet. ADMV7810. TYPICAL PERFORMANCE CHARACTERISTICS. A = +85°C. TA = +25°C. TA = –55°C. INPUT RETURN LOSS. OUTPUT RETURN LOSS
该数据表的模型线
文件文字版本
Data Sheet ADMV7810 TYPICAL PERFORMANCE CHARACTERISTICS 30 0 T 25 A = +85°C –2 TA = +25°C 20 TA = –55°C –4 15 INPUT RETURN LOSS B) OUTPUT RETURN LOSS d ( –6 ) 10 GAIN S B S 5 O –8 SE (d N 0 –10 URN L T –5 –12 ESPO RE R –10 UT –14 –15 INP –16 –20 –25 –18 –30 –20 79 80 81 82 83 84 85 86 87 88
009
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
012
FREQUENCY (GHz) FREQUENCY (GHz)
16409- 16409- Figure 9. Broadband Gain and Return Loss Response vs. Frequency, Figure 12. Input Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA IDD = 800 mA
26 0 TA = +85°C 24 TA = +25°C –5 TA = –55°C 22 B) d 20 ( S –10 S O 18 B) d N ( 16 URN L –15 T AI G 14 RE UT –20 12 P UT O 10 TA = +85°C –25 T 8 A = +25°C TA = –55°C 6 –30 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
010
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
013
FREQUENCY (GHz) FREQUENCY (GHz)
16409- 16409- Figure 10. Gain vs. Frequency over Various Temperatures, IDD = 800 mA Figure 13. Output Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA
26 –30 500mA 600mA TA = +85°C 24 700mA –35 TA = +25°C 800mA TA = –55°C 22 900mA ) B –40 20 (d N –45 18 IO B) T d A L N ( 16 –50 SO AI G 14 SE I –55 12 EVER R –60 10 –65 8 6
1
–70
1
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
0
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
014
FREQUENCY (GHz) FREQUENCY (GHz)
16409- 16409- Figure 11. Gain vs. Frequency over IDD Figure 14. Reverse Isolation vs. Frequency over Various Temperatures, IDD = 800 mA Rev. A | Page 7 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
009
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
012
FREQUENCY (GHz) FREQUENCY (GHz)
16409- 16409- Figure 9. Broadband Gain and Return Loss Response vs. Frequency, Figure 12. Input Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA IDD = 800 mA
26 0 TA = +85°C 24 TA = +25°C –5 TA = –55°C 22 B) d 20 ( S –10 S O 18 B) d N ( 16 URN L –15 T AI G 14 RE UT –20 12 P UT O 10 TA = +85°C –25 T 8 A = +25°C TA = –55°C 6 –30 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
010
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
013
FREQUENCY (GHz) FREQUENCY (GHz)
16409- 16409- Figure 10. Gain vs. Frequency over Various Temperatures, IDD = 800 mA Figure 13. Output Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA
26 –30 500mA 600mA TA = +85°C 24 700mA –35 TA = +25°C 800mA TA = –55°C 22 900mA ) B –40 20 (d N –45 18 IO B) T d A L N ( 16 –50 SO AI G 14 SE I –55 12 EVER R –60 10 –65 8 6
1
–70
1
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
0
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
014
FREQUENCY (GHz) FREQUENCY (GHz)
16409- 16409- Figure 11. Gain vs. Frequency over IDD Figure 14. Reverse Isolation vs. Frequency over Various Temperatures, IDD = 800 mA Rev. A | Page 7 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE